Dell POWEREDGE R710 Manual

1
Dell™ Glossary
NOTE: For additional information on storage terminology, visit the Storage
Networking Industry Association's website at www.snia.org and click on the
dictionary.
A — Ampere(s).
AC — Alternating current.
ACPI — Advanced Configuration and Power Interface. A standard interface for
enabling the operating system to direct configuration and power management.
ambient temperature — The temperature of the area or room where the system is
located.
ANSI — American National Standards Institute. The primary organization for
developing technology standards in the U.S.
asset tag — An individual code assigned to a system, usually by an administrator, for
security or tracking purposes.
backup — A copy of a program or data file. As a precaution, back up your system’s
hard drive(s) on a regular basis.
blade — A module that contains a processor, memory, and a hard drive. The modules
are mounted into a chassis that includes power supplies and fans.
BMC — Baseboard management controller.
bootable media — A CD, diskette, or USB memory key that is used to start your
system if the system will not boot from the hard drive.
BTU — British thermal unit.
bus — An information pathway between the components of a system. Your system
contains an expansion bus that allows the processor to communicate with controllers
for the peripheral devices connected to the system. Your system also contains an
address bus and a data bus for communications between the processor and RAM.
C — Celsius.
cache — A fast storage area that keeps a copy of data or instructions for quick data
retrieval.
CA — Certificate authority.
CIM — Common Information Model describes the management information utilized
by the DMTF. It provides mapping techniques for interchange of CIM data with MIB
data from SNMP agents.
cm — Centimeter(s).

Dell POWEREDGE R710 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF7
Processor cache	8 MB
Processor cores	4
Processor model	E5530
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5520
Number of QPI links	2
Processing Die size	263 mm²
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	3.5 \
HDD capacity	146 GB
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	DVD-ROM
Total storage capacity	292 GB
Maximum storage capacity	6 TB
Internal memory	12 GB
Memory clock speed	1066 MHz
Memory layout (slots x size)	6 x 2 GB
Graphics card	G200
Dimensions (WxDxH)	443.1 x 680.7 x 86.4 mm
Non-operating relative humidity (non-condensing)	5 - 95 %
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Power supply	570 W
Power requirements	90 - 264V
Compatible operating systems	Windows Server, Standart Business Server, Novell SUSE Linux, Red Hat Linux Enterprise
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	20 - 80 %
Networking features	Gigabit Ethernet
Processor ARK ID	37103
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	680.7 mm
Width	443.1 mm
Height	86.4 mm
Weight	26100 g