EL-MF877-00 Page 2
Template Revision A
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1: Bushing Screwdriver
Description #2: Crossing Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the monitor on the desk, remove the VESA mounting cover with hand.
2. Unlock the 4 screws which they fix the VESA mounting by 2# screwdriver.
3. Unlock the 4 screws which they fix the stand by 2# screwdriver.
4. Remove the front bezel with hand from product
5. Remove the backcover with hand from Product.
6. Seprate the Keypad and backcover with hand
7. Unlock the 2 screws which they fix the chassis and panel, and then pull the LVDS out .
8. Unlock 2 screws for DVI port, D-SUB port, Power port, and 7 screws which they fix between chassis and PCA
boards, power board and IF board. Pull the wires out.
9. Unlock the 2 screws which they fix between the bottom-side and the base, and then unlock the 12 screws which they
fix between the base and base-cover.
10. Remove the arm-rear and then unlock the 4 screws which they fix between the arm-front and the rion.
11. To see the detail process are as attached files including assemble panel.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. System disassembly methods :
2. Panel disassembly methods:
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