EasyManuals Logo
Home>HP>Desktop>Chromebox G2

HP Chromebox G2 User Manual

HP Chromebox G2
6 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #2 background imageLoading...
Page #2 background image
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver
#1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. remove bottom rubber cover foot x4, screw*4, and bottom cover sub-assy.
2. remove side cover screw*2, and side cover sub-assy.
3. remove bottom shielding screw*4, pull out DC cable, and bottom shielding sub-assy.
4. remove SSD screw*1, WLAN screw*1, pull out WLAN cable, and SSD/WLAN sub-assy.
5. remove DDR shielding can, and DDR RAM sub-assy.
6. remove MB screw*4, pull out power board cable, and MB sub-assy.
7. remove Top shielding screw*4, and Top shielding sub-assy.
8. remove power board screw*2, and power board sub-assy.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove bottom cover rubber, bottom cover screw and disassembly

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the HP Chromebox G2 and is the answer not in the manual?

HP Chromebox G2 Specifications

General IconGeneral
Bus typeOPI
Tjunction100 °C
Processor cache2 MB
Processor cores2
System bus rate4 GT/s
Processor familyIntel® Celeron®
Processor codenameKaby Lake
Processor frequency1.8 GHz
Processor cache typeSmart Cache
Configurable TDP-down10 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Number of processors installed1
Maximum number of PCI Express lanes10
Memory types supported by processorDDR3L-SDRAM, DDR4-SDRAM, LPDDR3-SDRAM
Memory clock speeds supported by processor1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)34.1 GB/s
Maximum internal memory supported by processor32 GB
Memory slots2x SO-DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed2400 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory16 GB
Memory layout (slots x size)1 x 4 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceSATA
Storage mediaSSD
Card reader integratedYes
Compatible memory cardsMicroSD (TransFlash)
On-board graphics card ID0x5906
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 610
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)900 MHz
Number of displays supported (on-board graphics)3
Antenna type2x2
Bluetooth version4.2
Cabling technology10/100/1000Base-T(X)
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
Chassis typeMini PC
Product colorBlack
Country of originChina
Cable lock slot typeKensington
Operating system installedChromeOS
Power supply65 W
Sustainability certificatesENERGY STAR
Processor ARK ID96507
Processor package size42 x 24 mm
Supported instruction setsSSE4.1, SSE4.2
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Width149.3 mm
Height40 mm
Weight570 g
Package depth190 mm
Package width235 mm
Package height110 mm
Package weight790 g

Related product manuals