HP Compaq dc5800 Install Guide

EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 Phillips screwdriver
Description #2 Dikes
Description #3 Torx screwdriver T-15
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. To remove the access panel, press the buttons on the left and right sides of the computer (1), slide the access panel
back until it stops, and then lift it up and off the chassis (2) (see Figure 1).
2. Lift up the green latch behind the upper right side of the bezel and push down on the latch behind the lower right side
of the bezel (1), then pull the right side of the bezel off the chassis (2), followed by the left side. (see Figure 2).
3. Remove or cut all expansion cards, cables, and any other devices from the system board.
4. To remove the battery:
Locate the battery and battery holder on the system board. Depending on the type of battery holder on the system
board, complete the following instructions to remove the battery.
TYPE 1 BATTERY HOLDER (see Figure 3):
Lift the battery out of the holder.
TYPE 2 BATTERY HOLDER (see Figure 4):
To release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. When the
battery pops up, lift it out.
TYPE 3 BATTERY HOLDER (see Figure 5):
Pull back on the clip that holds the battery in place, and then remove the battery.
5. To remove the system board (see Figure 6):
a. Remove the fan shroud from the chassis.
b. Rotate the drive cage to its upright position.
c. Rotate the power supply to its full upright position.
d. Disconnect all data and power cables from the system board.
e. Disconnect the serial port from the system board.
f. Remove the heatsink from the system board by loosening the four captive screws that secure the heatsink to the
system board, and then lifting the heatsink from the system board.
g. Remove the seven screws that secure the system board to the chassis.
h. Lift up the front of the system board, and then pull the system board forward, up, and out of the chassis.
6. To remove the power supply (see Figure 7):
a. Rotate the drive cage up and disconnect the power cables from all of the drives.
b. Disconnect the power cables from the system board.
c. Release the power supply cables from the cable retaining clips on the bottom of the chassis and under the drive
cage.
d. Rotate the power supply to its full upright position, pull the power supply forward (1), and then lift the power supply
straight up and out of the chassis (2).
7. HP uses seven different power supply vendors. The power supply cover is removed using the same procedure for
each power supply; however, the internal components differ for all of the power supplies. To remove the power supply
cover:
a. Using dikes, cut the two plastic clamps that secure the wires to the power supply cover (see Figure 9).
b. Using a phillips screwdriver, remove the four screws from the top, two screws from the back, and two screws from
the front of the power supply, that secure the cover to the power supply (see Figures 8, 9, & 10).
c. Lift the covers off the power supply. The cover you remove is in two pieces, and hinges connect the covers to the
power supply chassis.
After you remove the cover, refer to the procedures below for the remaining power supply disassembly instructions:

HP Compaq dc5800 Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	E0
Processor cache	6 MB
Processor cores	2
Processor model	E8400
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
CPU multiplier (bus/core ratio)	9
Number of Processing Die Transistors	410 M
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 1 GB
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi
Total storage capacity	250 GB
Audio system	High Definition Audio
Product type	PC
Drive bays	2 external 5.25 inch, 1 external 3.5 inch 2 internal 3.5 inch
Driver LAN	Microsoft Windows XP, Microsoft Windows Vista, FreeDos, Linux
LightScribe	Yes
Upgrade type	Windows Vista capable
Keyboard type	HP PS/2 Standard Keyboard
Audio included	Integrated High Definition audio with ADI1884 codec, microphone and headphone front ports, line-out and line-in rear ports, multistreaming capable, internal PC speaker
Diskette drive	Optional
Expansion slots	1 full-height PCI, 1 full-height PCI Express x16, 2 full-height PCI Express x1
Pointing device	HP PS/2 2-Button Optical Scroll Mouse
Power management	Operating Voltage Range: 90 – 264 VAC; Rated Voltage Range: 100 – 240 VAC; Rated Line Frequency: 50/60 Hz; Operating Line Frequency Range: 47 – 63 Hz; Rated Input Current 80 Plus: 2.5 A; Current Leakage (NFPA 99): \u003C 275 µA; System Heat Dissipation 80 Plus: Typical 315 btu/hr (79 kg-cal/hr), Maximum 1575 btu/hr (397 kg-cal/hr; Power Supply Fan: Variable speed fan, Power Consumption in ES Mode – Suspend to RAM (S3) (Instantly Available PC): \u003C4 W
Security features	Kensington Lock
Power requirements	Input voltage 90 – 264 / 100 – 240 VAC, 50/60 Hz, 47 – 63 Hz, active PFC optional (External 80% High Efficiency) Operating Voltage Range: 90 – 264 VAC; Rated Voltage Range: 100 – 240 VAC; Rated Line Frequency: 50/60 Hz; Operating Line Frequency Range: 47 – 63 Hz; Rated Input Current 80 Plus: 2.5 A; Current Leakage (NFPA 99): \u003C 275 µA; System Heat Dissipation 80 Plus: Typical 315 btu/hr (79 kg-cal/hr), Maximum 1575 btu/hr (397 kg-cal/hr; Power Supply Fan: Variable speed fan, Power Consumption in ES Mode – Suspend to RAM (S3) (Instantly Available PC): \u003C4 W
External drive bays	2x 5.25\
Networking features	Gigabit Ethernet
Video card features	3D/2D Controller: support is fully compliant with Microsoft standard API such as Microsoft DirectX9, DirectXVA, VMR9, GDI/GDI+; OpenGL 1.4.; Integrated VGA Controller; integrated 350 MHz RAMDAC; 400 MHz Controller Clock Speed; Overlay Planes: Single overlay support with 5x3 filtering; Maximum Color Depth: 32 bits/pixel; Multi-display Support: 2 displays can be supported via the motherboard's VGA connectors and SDVO/ADD2 option Intel Graphics Media Accelerator 3100 \u003C85 Hz @ 1920x1440, 75 Hz @ 2048x1536
Acoustic power emissions	IDLE (Fixed disk drive spinning): LWAd = 3.8 Bels; FIXED DISK (Random write): LWAd = 3.9 Bels
Non-operating relative humidity (non-condensing)	5 - 90 %
Bundled software	On some models only (not included with FreeDOS): HP ProtectTools Security Solutions, HP Backup and Recovery Manager, HP Insight Diagnostics (available via HP Backup and Recovery Manager), HP Software Agent, HP Total Care Advisor, HP Client Configuration Manager, HP Client Manager for Altiris, HP SoftPaq Download Manager, HP Client Catalog for Microsoft SMS, HP Systems Software Manager, Computer Setup Utility, Altiris Out-of-Band Management Solution, McAfee AntiVirus trial version, Roxio DigitalMedia Plus 7.2/Easy Media Creator 9 Optional preloaded software, only for certain configurations: PDF Complete, Computrace for Desktops, Verdiem Surveyor agent, InterVideo WinDVD 5.0, Microsoft Office 2007 Basic, Microsoft Office 2007 Professional, Microsoft Office 2007 Small Business, Microsoft Internet Explorer with AOL Toolbar
Applications supported	Windows Vista Premium ready
Operating system installed	Windows Vista Business
Compatible operating systems	FreeDOS
Optional operating system supplied	Windows XP Professional
I/O ports	Rear: 6 USB 2.0, 1 serial port, 1 optional serial port, 1 optional parallel port, 2 PS/2, 1 RJ-45, 1 VGA, audio in/out; Front: 2 USB 2.0, audio ports
Serial ports quantity	1
USB 2.0 ports quantity	8
Parallel ports quantity	0
Chassis type	Micro Tower
Country of origin	China
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Discrete graphics card model	Intel® GMA 3100
Maximum graphics card memory	0.256 GB
On-board graphics card model	Not available
Power consumption (typical)	300 W
Processor code	SLB9J
Processor ARK ID	33910
Processor package size	37.5 x 37.5 mm

Weight and Dimensions

Depth	428 mm
Width	176 mm
Height	377 mm
Weight	8900 g
Package weight	4450 g