EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle the cover of monitor
3. Dismantle the button，pull out the pin of KEPC board ,get down the KEPC board
4. Dismantle mainframe
5. Dismantle BEZEL
6. Dismantle the screws of PANEL
7. Pull out the PIN of lamp
8. Pull out the PIN of LVDS cable，separate the mainframe and PANEL
9. Dismantle the power board screws
10. Dismantle the VGA screws
11. First: Tear off the adhesive tape;
12. Second: Pull out the connector PIN which connect PWPC and main board;
13. Third: Take off both boards
14. Pull out the pin of KEPC cable
15.
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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