List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Take Screw(x4) Off From Stand & Remove Stand
2. Remove Rear Cover From Display Head
3. Remove Front Cover From Display Head
4. Remove Rubber foot From Rear Cover
5. Remove Key Board Off From Chassis
6. Remove Lamp Cable & LVDS Cable Out of Panel
7. Take Screw(x4) Off From Chassis Cover & Remove Panel
8. Take Screw(x6) Off From P.C.B
9. Take Screw(x1) Off From USB
10. Take Screw(x7) Off From P.C.B
11. Remove BKT (Printed Circuit Assemblies>10cm*2
12. Remove Mylar From Chassis Cover & Remove USB BD From Chassis
13. LCD PANEL EXPLODE
14. Take Screw(*4)Off From Quick Release
15. Remove Quick Release off Stand Base
16. Remove the PET(Al Film) cover shield
17. Dismantle the case top ( Down)
18. Dismantle the case top (Right or Left )
19. Separate case top (push the case top because of damages on COF)
20. Dismantle the PCB
21. Remove the Conductive Tape
22. Remove the Board Assay
23. Remove the Guide Panel
24. Remove Optical Sheet
25. Remove Optical LGP
26. Disassembling Complete
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision A
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