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HP Elite Dragonfly User Manual

HP Elite Dragonfly
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EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Elite Dragonfly Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[X] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
0
External electrical cables and cords
DC Cable for External Power Supply
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
0

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HP Elite Dragonfly Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorBlack
Country of originChina
Intel® vPro™ Platform EligibilityNo
RGB color spaceNTSC
Display diagonal13.3 \
Touch technologyMulti-touch
Anti-glare screenAlways gives an optimal view, even in direct sunlight.
Display brightness400 cd/m²
Native aspect ratio16:9
NTSC coverage (typical)72 %
Display bezel technologyMicro-Edge
Display diagonal (metric)33.8 cm
Memory slots1x SO-DIMM
Internal memory16 GB
Memory clock speed2133 MHz
Memory form factorSO-DIMM
Internal memory typeLPDDR3-SDRAM
Maximum internal memory- GB
On-board graphics card ID0x3EA0
Discrete graphics card modelNot available
On-board graphics card modelIntel® UHD Graphics
Maximum on-board graphics card memory32 GB
On-board graphics card OpenGL version4.5
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfacePCI Express, NVMe
Storage mediaSSD
Total storage capacity512 GB
Number of SSDs installed1
MIMO typeMulti User MIMO
Antenna type2x2
Bluetooth version5.0
Top Wi-Fi standardWi-Fi 6 (802.11ax)
WLAN controller modelIntel Wi-Fi 6 AX200
WLAN controller manufacturerIntel
HDMI version1.4
USB 2.0 ports quantity0
Thunderbolt 3 ports quantity2
Pointing deviceClickpad
Keyboard special featuresMorsbestendig
Operating system architecture64-bit
AC adapter power65 W
Battery weight220 g
Battery capacity38 Wh
Sustainability certificatesENERGY STAR
HP segmentBusiness
HP speaker typeHP Quad Speakers
HP Management toolsHP Driver Packs; HP System Software Manager (SSM); HP BIOS Config Utility (BCU); HP Client Catalog; HP Manageability Integration Kit Gen3
Bus typeOPI
Tjunction100 °C
Processor cache6 MB
Processor modeli5-8265U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor socketBGA 1528
Processor threads8
Processor codenameWhiskey Lake
Configurable TDP-up25 W
Processor frequency1.6 GHz
Processor cache typeL3
Configurable TDP-down10 W
Processor lithography14 nm
PCI Express slots version3.0
Processor boost frequency3.9 GHz
PCI Express configurations1x4, 2x2
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency1.8 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes16
Processor ARK ID149088
Processor package size46x24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Package depth402 mm
Package width137 mm
Package height315 mm
Harmonized System (HS) code84713000
Weight and Dimensions IconWeight and Dimensions
Depth197.5 mm
Width304.3 mm
Height16.1 mm
Weight990 g

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