EL-MF877-00 Page 2
Template Revision A
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
Description #2 SCREW DRIVER(HEX HEAD)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Stand/Base Assy From Display Head
2. Remove Rear Cover Assy From Display Head
3. Remove Bracket Assy frome Display
4. Remove Key Board and Speaker from Front Cover Assy
5. Disassemble Front Cover ASSY
6. Disassemble Webcam ASSY
7. Take 4pcs Al foil Off From Chassis Cover & Remove Panel
8. Take 10pcs Screw then remove Interface BD and Power BD
9. Press release Base Button than remove Stand Assy from Base Assy
10. Disassemble Stand Assy
11. Disassemble Base Assy
12. LCD Panel explode
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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