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HP EliteBook 850 G2 User Manual

HP EliteBook 850 G2
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Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to
the computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the computer
is off or in Hibernation, turn the computer on, and then shut it down through the operating system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and be sure
that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic fields, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its
life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
46 Chapter 4 Removal and replacement procedures preliminary requirements ENWW

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HP EliteBook 850 G2 Specifications

General IconGeneral
Bus typeDMI2
SteppingF0
Tjunction105 °C
Processor cache4 MB
Processor cores2
Processor modeli7-5500U
System bus rate5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-5500 Mobile Series
Processor socketBGA 1168
Processor threads4
Processor codenameBroadwell
Processor frequency2.4 GHz
Processor cache typeL3
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency3 GHz
Processor operating modes32-bit, 64-bit
ECC supported by processorNo
PCI Express configurations4x1, 2x4
Thermal Design Power (TDP)15 W
Configurable TDP-down frequency0.6 GHz
Maximum number of PCI Express lanes12
On-board graphics card ID0x1616
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 5500
Graphics card Open GL supportYes
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory16 GB
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version11.2
On-board graphics card dynamic frequency (max)950 MHz
Processor codeSR23W
Processor ARK ID85214
Processor package size40 x 24 x 1.3 mm
CPU configuration (max)1
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Smart Connect Technology-
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Power adapter depth40 mm
Power adapter width95 mm
Power adapter height26.5 mm
Intel segment taggingEnterprise
Intel® Virtualization Technology (Intel® VT)VT-x, VT-d
Form factorClamshell
Product typeLaptop
Product colorBlack, Silver
Country of originChina
Memory slots2x SO-DIMM
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorSO-DIMM
Internal memory typeDDR3L-SDRAM
Memory layout (slots x size)1 x 8 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Total storage capacity500 GB
Compatible memory cardsSD, SDHC, SDXC
Display surfaceMatt
Display diagonal15.6 \
Display brightness300 cd/m²
Native aspect ratio16:9
Contrast ratio (typical)300:1
Display number of colors16.78 million colors
Audio systemDTS Studio Sound
Video capturing speed30 fps
Wi-Fi standards802.11a, 802.11b, 802.11g
Bluetooth version4.0
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity0
Pointing deviceTouchpad
Recovery operating systemWindows 8.1 Pro
Operating system installedWindows 7 Professional
Operating system architecture64-bit
Battery voltage11.1 V
Battery capacity4504 mAh
Battery life (max)- h
Number of battery cells3
AC adapter power45 W
AC adapter frequency47/63 Hz
AC adapter input voltage90 - 265 V
AC adapter output voltage19.5 V
Operating altitude-15.2 - 3048 m
Non-operating altitude-15.2 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)5 - 35 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth253.6 mm
Width375.5 mm
Height21.4 mm
Weight1830 g

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