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HP EliteDesk 800 G3 Disassembly Instructions

HP EliteDesk 800 G3
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E
L-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 800 G3 Tower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm 2
Batteries All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Acbel STD 3
External electrical cables and cords 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent

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HP EliteDesk 800 G3 Specifications

General IconGeneral
Display includedNo
Keyboard includedYes
Operating system architecture64-bit
Sustainability certificatesENERGY STAR
Power supply65 W
Product typeMini PC
Motherboard chipsetIntel® Q270
Product colorBlack, Silver
Country of originChina
Number of 2.5\" bays1
HDMI ports quantity-
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity6
Antenna type2x2
Cabling technology10/100/1000Base-T(X)
Top Wi-Fi standardWi-Fi 5 (802.11ac)
WLAN controller modelIntel Dual Band Wireless-AC 8265
Ethernet LAN data rates10, 100, 1000 Mbit/s
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceNVMe, PCI Express
Storage mediaSSD
Total storage capacity256 GB
Memory slots2x SO-DIMM
Internal memory8 GB
Memory clock speed2400 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Memory layout (slots x size)1 x 8 GB
Bus typeDMI3
Tjunction80 °C
Processor cache6 MB
Processor cores4
Processor modeli5-7500T
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor socketLGA 1151 (Socket H4)
Processor codenameKaby Lake
Processor frequency2.7 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.3 GHz
PCI Express configurations2x8, 1x8+2x4
Thermal Design Power (TDP)35 W
Configurable TDP-down frequency1.7 GHz
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor1.35 V
Memory clock speeds supported by processor1333, 1600, 2133, 2400 MHz
Maximum internal memory supported by processor64 GB
On-board graphics card ID0x5912
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 630
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1100 MHz
Number of displays supported (on-board graphics)3
HP segmentBusiness
Scalability1S
Processor ARK ID97121
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0
Thermal solution specificationPCG 2015A
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth175 mm
Width177 mm
Height34.2 mm
Weight1210 g

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