EL-MF877-00 Page 2
Template Revision C
Last revalidation date 18-March-2021
HPI instructions for this template are available at EL-MF877-01
Quantity of
items
included in
product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Lay the display on soft desk and push the button of stand to unlock the stand, then pull out the stand form the monitor
head.
2. Twist out the screw and separate base and stand.
3. Strip two screws from the rear cover,then move rear cover follow the below way
4. Strip four screws from the hinge.
5. Remove the acetate tapes from the LVDS/ LED cable.
6. Pull out the LVDS/ LED cable to panel.
7. Strip fourteen screws from the rear cover supporter and M/B.