HP OMEN 17 Product End-Of-Life Disassembly Instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: External Options
Marketing Name / Model
[List multiple models if applicable.]
OMEN by HP 17 Laptop PC
OMEN by HP Laptop
OMEN by HP Laptop 17
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact
.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button
style batteries
0
Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[4] screws
[0] snaps
[0] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring

HP OMEN 17 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Black, Carbon, Red
Country of origin	China
Market positioning	Gaming
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 4 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	1000 GB
Compatible memory cards	SD
Number of HDDs installed	1
Display surface	Matt
Display diagonal	17.3 \
Native aspect ratio	16:9
On-board graphics card ID	0x191B
Discrete graphics card model	NVIDIA® GeForce® GTX 960M
On-board graphics card model	Intel® HD Graphics 530
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR5
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	950 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity	0
Sustainability certificates	EPEAT Silver, ENERGY STAR
Cable lock slot type	Kensington
Password protection type	Power on
AC adapter power	120 W
Battery capacity	62 Wh
Number of battery cells	6
Keyboard layout	QWERTY
Pointing device	Touchpad
Bus type	DMI3
Stepping	R0
Tjunction	100 °C
Processor cache	6 MB
Processor cores	4
Processor model	i5-6300HQ
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel® Core™ i5-6300 Mobile Series
Processor socket	BGA 1440
Processor codename	Skylake
Processor frequency	2.3 GHz
Processor cache type	Smart Cache
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	45 W
Maximum number of PCI Express lanes	16
Processor code	SR2FP
Processor ARK ID	88959
Processor package size	42 x 28 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	279 mm
Width	416 mm
Height	29.9 mm
Weight	2750 g