Include the cartridges, print heads, tubes, vent
chambers, and service stations.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Dis-fasten BASE Screw*6
2. Remove BASE and remove Battery connector
3. Dis-fasten SSD screw*2
4. Remove SSD*2 PCS and Ram*2PCS
5. Dis-fasten Battery and speaker screw*7
6. Remove Battery and Speaker
7. Dis-fasten IO BKT and DC BKT screw*4
8. Remove IO BKT and DC BKT
9. Dis-fasten Thermal model Screw*6 and Relase Thermal modle screw*7
10. Remove Thernal module and DC in Cable
11. Dis-fasten PCB screw *7 and 2nd panel DB screw*2
12. Release KB FPC/ 2nd panel DB /Antenna connector /IR FFC / LVDS FPC /Power FFC and Remove MB PCB
13. Dis-fasten Cu plate screw *1/ Power screw*1 and IR DB screw*2
14. Remove Cu Plate and KB FPC
15. Remove 2nd DB with 2nd Panel FPC / IR DB with IR FFC and Power DB
16. TOP remove release, dis-fasten Hinge screw *6 and remove LCD part
17. Remove Bezel , dis-fasten hinge cap screw*2 and remove hing cap*2PCS
18. Dis-fasten Hinge screw*6
19. Remove Panel Easy pull Adhesive
20. Remove Panel and Hinge*2PCS