EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Please refer to the 3.2.2 disassemble rear cover
2. Please refer to the 3.2.3 disassemble the stand
3. Please refer to the 3.2.4 disassemble MB Shielding
4. Please refer to the 3.2.5 disassemble HDD & ODD
5. Please refer to the 3.2.6 disassemble Speaker
6. Please refer to the 3.2.7 disassemble CPU thermal module
7. Please refer to the 3.2.8 disassemble FAN Module
8. Please refer to the 3.2.9 disassemble converter board
9. Please refer to the 3.2.10 disassemble Webcam
10. Please refer to the 3.2.11 disassemble Wireless card
11. Please refer to the 3.2.12 disassemble the cables connected to MB and Base pan
12. Please refer to the 3.2.13 disassemble MB and MB battery
13. Please refer to the 3.2.14 disassemble CPU and DDR
14. Please refer to the 3.2.15 separate Base pan and front bezel and panel
15. Please refer to the 3.2.16 remove Mouse/Keyboard Battery/MB
16. Please refer to the 3.2.17 remove power supply
17.
18.
19.
20.
21.
22.
23.
24.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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