HP Pavilion dv4 Product End-Of-Life Disassembly Instructions

EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 screw driver philip #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove battery module
2. Remove HDD & RAM & MINICARD door.
3. Remove HDD module
4. Remove expansion memory
5. Remove Mini-CARD
6. Remove ODD assembly
7. Remove Keyboard
8. Remove strip cover (with power button PCB & Capacitive PCB)
9. Divide strip assy (with speaker mesh & KB deck)
10. Remove LCD cable and antenna
11. Divide LCD assembly from base assembly
12. Divide logic-up assembly(with TP module & Speaker module) from base assembly
13. Divide M/B(with CPU and memory and thermal module) from base assembly
14. Remove Fan assembly from logic lower.
15. Remove DC IN cable wire & RJ11&Tv_tuner wire from logic-low assembly
16. Divide LCD cover & LCD bezel.
17. Divide LCD panel and Hinge Bracket.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP Pavilion dv4 Specifications

General

Bus type	DMI
Stepping	L1
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-3210M
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-3200 Mobile series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	25
Maximum number of PCI Express lanes	16
Motherboard chipset	-
Memory slots	2x SO-DIMM
Internal memory	8 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	750 GB
Compatible memory cards	MMC, SD
Number of HDDs installed	1
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0x166
On-board graphics card model	Intel® HD Graphics 4000
On-board graphics card family	Intel® HD Graphics
On-board graphics card memory	1.696 GB
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1100 MHz
Audio system	Beats Audio
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
eSATA/USB 2.0 ports quantity	0
Pointing device	Touchpad
Trial software	Norton Internet Security 2011
Bundled software	Adobe Reader\\r Adobe Shockwave Player\\r Adobe Flash Player\\r Evernote\\r Microsoft Silverlight\\r HP CoolSense\\r HP ProtectSmart\\r HP Launch Box\\r Microsoft Office Starter\\r Windows Live Essentials 2011\\r Windows Live Mail\\r Windows Live Messenger\\r Windows Live Photo Gallery\\r Windows Live Movie Maker\\r Windows Live Writer\\r Windows Live Mesh\\r HP MyRoom\\r Internet Explorer 9\\r Skype\\r Bing Bar f/ Internet Explorer 9
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Country of origin	China
Battery capacity	62 Wh
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Processor code	SR0N0
Processor ARK ID	65708
Processor package size	31.0 x 24.0 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	343.9 mm
Width	233.9 mm
Height	33.528 mm
Weight	2170 g
Height (front)	29.21 mm