HP ProBook 650 G1 User Manual

Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
Cross head
of screwdriver
Description #2
TORX T8
(2.31mm)
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Follow steps described in Disassembly instruction (file attached)
2. If parts can be removed without using a tool, remove it first.
3. Use correct screwdriver and torque value before unlock the screw.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

HP ProBook 650 G1 Specifications

General

Bus type	DMI
Stepping	C0
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-4210M
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-4200 Mobile series
Processor socket	PGA946
Processor threads	4
Processor codename	Haswell
Processor frequency	2.6 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	37 W
Maximum number of PCI Express lanes	16
On-board graphics card ID	0x416
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4600
Graphics card Open GL support	Yes
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1150 MHz
Processor code	SR1L4
Processor ARK ID	81012
Intel TSX-NI version	0.00
Processor package size	37.5 x 37.5 x 4.7 mm
CPU configuration (max)	1
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Smart Connect Technology	-
Intel Identity Protection Technology version	1.00
Intel segment tagging	Enterprise
Maximum internal memory (64-bit)	16 GB
Form factor	Clamshell
Product type	Laptop
Product color	Black, Silver
Country of origin	China
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3L-SDRAM
HDD size	2.5 \
HDD speed	7200 RPM
HDD interface	SATA II
Storage media	HDD
Optical drive type	DVD Super Multi DL
Total storage capacity	500 GB
Display surface	Matt
Display diagonal	15.6 \
Native aspect ratio	16:9
Audio system	DTS Studio Sound HD
Wi-Fi standards	802.11a, 802.11g, 802.11b, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	5
Pointing device	Touchpad
Recovery operating system	Windows 8.1 Pro
Operating system installed	Windows 7 Professional
Battery capacity	55 Wh
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	ENERGY STAR

Weight and Dimensions

Depth	257 mm
Width	378 mm
Height	25.3 mm
Weight	2320 g