EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Remove the top cover and locate the battery on the system board.
2. Capacitors in 460W ATX power supply=> 2.5 cm () - Remove the power supply from the system with a T-15 torx
driver. With a #2 Philips screw driver remove the screws securing the top cover then locate the capacitors and pry from
the PCB with a flat head screw driver or Long Nose Plier () and dispose of properly.
3. Capacitors in 460W and 750W redundant power supply=> 2.5 cm () - Remove the power supply from the system with
a T-15 torx driver. With a #2 Philips screw driver remove the screws securing the top cover then locate the capacitors
and pry from the PCB with a flat head screw driver or Long Nose Plier and dispose of properly.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1 –RTC location
Attachment 2-4- 2.5cm Capacitor location
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