EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use tool to separate rear cover from monitor head.
2. Use tool to release screw*6 on the interface board, then disassemble interface-BD from the chassis by hand.
3. Disassemble the bracket Type C from bezel by hand.
4. Use tool to release screw*2 on the control board, then disassemble control board and FFC Cable from the chassis by
hand.
5. Use tool to release screws*18 on assembly MF, then separate the assembly MF from bezel.
6. Disassemble the eDP cable from connector by hand.
7. Disassemble panel from bezel by hand.
8. Disassemble magnets, power button, control button, rubber power button and rubber control button from bezel by hand.
9. Use tool to release glass on bezel, then separate the glass from bezel.
10.
11.
12.
13.
14.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Use tool to separate rear cover from monitor head.
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