EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Quantity
of items
included
in product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove access panel (Step1-2)
2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step3~Step4)
3. Remove ODD/ HDD from chassis (Step4~Step8)
4. Remove all cables and heat sink from MB (Step9~Step12)
5. Separate heatsink(Step13~Step14)
6. Remove the Memory/ CPU/ WLAN/SSD/GFX and Battery from MB (Step14~Step23)
7. Remove MB from chassis (Step24-25)
8. Remove the PSU from chassis (Step26~Step28)
9. Separate PSU and remove the Electrolytic Capacitors (Step 29~Step33)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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