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HP Spectre Pro x360 G2 User Manual

HP Spectre Pro x360 G2
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HP Spectre Pro x360 Convertible PC G2
Maintenance and Service Guide
IMPORTANT! This document is intended for
HP authorized service providers only.

Table of Contents

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HP Spectre Pro x360 G2 Specifications

General IconGeneral
Form factorConvertible (Folder)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
Motherboard chipsetIntel SoC
Numeric keypadNo
Pointing deviceTouchpad
Full-size keyboardYes
Internal memory8 GB
Memory clock speed1600 MHz
Internal memory typeLPDDR3-SDRAM
Memory layout (slots x size)1 x 8 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfaceM.2, SATA
Storage mediaSSD
Total storage capacity256 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Operating system architecture64-bit
Display surfaceGloss
Display diagonal13.3 \
Touch technologyMulti-touch
Touchscreen typeCapacitive
Native aspect ratio16:9
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Battery capacity56 Wh
Number of battery cells3
Intel segment taggingHome Office, Small Business
Number of built-in speakers2
WWANNot installed
Wi-Fi standards802.11a, 802.11b, 802.11g
Bluetooth version4.2
Top Wi-Fi standardWi-Fi 4 (802.11n)
Charging port typeDC-in jack
USB 2.0 ports quantity0
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6200 series
Processor socketLGA 1356 (Socket B2)
Processor threads4
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency2.8 GHz
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.4 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EY
Processor ARK ID88193
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
AC adapter power45 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
AC adapter output voltage19 V
Sustainability certificatesRoHS, EPEAT Silver, ENERGY STAR
HP segmentBusiness
HP Software providedHP Wireless Hotspot
Weight and Dimensions IconWeight and Dimensions
Depth218 mm
Width325 mm
Height15.4 mm
Weight1480 g

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