HP t310 G2 User Manual

EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1: Phillips screwdriver
Description #2: Diagonal cutting plier
Description #3 Nipper
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove chassis labels on label mylar tab
2. Remove chassis rubber and screws
3. Remove upper plastic and metal chassis
4. Remove EMI contact fingers and heatsink EMI gasket from the upper metal chassis
5. Remove light shielding rubber from the upper plastic chassis
6. Separate upper metal chassis from upper plastic chassis
7. Separate PCBA board from the chassis using the screwdriver
8. Separate lower metal chassis from lower plastic chassis
9. Remove label mylar tab
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP t310 G2 Specifications

General

Processor model	TERA2321
Processor frequency	- GHz
Product color	Silver
Panel mounting interface	100 x 100 mm
Internal memory	0.5 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Display included	No
Storage media	Flash
Total storage capacity	0.032 GB
Power supply	36 W
AC input voltage	100 - 240 V
AC input frequency	50 - 60 Hz
Cabling technology	10/100/1000Base-T(X)
Audio system	32-bit stereo
USB 2.0 ports quantity	6
Ethernet LAN (RJ-45) ports	1
VGA (D-Sub) ports quantity	0
Country of origin	China
Harmonized System (HS) code	84713000

Weight and Dimensions

Depth	137.5 mm
Width	65 mm
Height	187.2 mm
Weight	600 g
Width (without stand)	31.6 mm
Height (without stand)	185 mm