HP TouchSmart Series Disassembly Instructions

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part Description
Weight
(grams)
ISO
11469:2000
Plastic Part
Mark
Optional:
Photo
JAN_MAIN_REAR_COVER
JAN_MAIN_REAR_COVER
267g
>ABS<
JAN_CHIN
JAN_CHIN
118.25g
>ABS<
JAN_SIDE_CAP_RT
JAN_SIDE_CAP_RT
28.2g
>PMMA<
JAN_SIDE_CAP_RT
JAN_SIDE_CAP_RT
28.2g
PC+ABS
JAN_SIDE_CAP_LF
JAN_SIDE_CAP_LF
29.5g
>PMMA<
JAN_SIDE_CAP_LF
JAN_SIDE_CAP_LF
29.5g
>PC+ABS<
JAN_REAR_PANEL
JAN_REAR_PANEL
372g
>ABS<
JAN_LOWER_REAR_COVER
JAN_LOWER_REAR_COVER
99.9g
>ABS<
JAN_OUTER_BEZEL
JAN_OUTER_BEZEL
112.6g
>ABS<
JAN_INNER_BEZEL
JAN_INNER_BEZEL
93.6g
>ABS<
JAN_AMBIENT_LIGHT_FILLER
JAN_AMBIENT_LIGHT_FILLER
25.5g
>ABS<
JAN_SIDE_CAP_LF_NON_AMB
JAN_SIDE_CAP_LF_NON_AMB
29g
>PMMA<
JAN_SIDE_CAP_LF_NON_AMB
JAN_SIDE_CAP_LF_NON_AMB
29g
>PC+ABS<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 M3 Screwdriver
Description #2 M2 Screwdriver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. See detailed instructions attached below
2.
3.
4.
5.
6.
7.
8.

HP TouchSmart Series Specifications

General

Brand	HP
Model	TouchSmart Series
Category	Desktop
Language	English