HP TOUCHSMART TM2 Product End-Of-Life Disassembly Instructions

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Motor-screw-driver “+”
Cross head
of screwdriver
Description #2 Motor-screw-driver “*
TORX T8
(2.31mm)
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. remove 6-cell battery
2. remove 2 screws of RAM door, and then take out RAM door
3. remove 2 screws of HDD door, and then take out HDD door.
4. remove HDD from HDD bay
5. remove WWAN/WLAN antenna cable connection to M/B side
6. remove 2 screws on WWAN/WWAN module, and then take out WWAN/WWAN module from M/B.
7. remove 21 screws on the bottom case (follow the sequence as shown in SOP)
8. turn the unit 180 degree, then start to remove hinge cap-->Top hinge cover
9. open the LCM in 180 degree, lift the top cover and remove FFC cable for Touch pad module
10. remove the FFC cable for KBD, then Top cover can be removed completely
11. remove the rubber aside the LAN
12. remove the tape & gasket along with the WWAN cable, and then take out WWAN cable from the hole.
13. remove the upper screw*1 for LCM, seal off the tape along with WLAN cable and also take the cable out from the hole
14. remove the tape & gasket on the LVDS & transfer cable, and then take out LVDS & transfer cable
15. disassembly screw*2 for LCM bottom then close the A cover
16. disassembly screw*2 aside hinge cap, then LCM can be removed completely
17. remove blue tooth cable from M/B CNTR, then Blue tooth module can be removed from bottom case
18. remove DC CNTR screw *2
19. remove power SW/B FFC from power board CNTR, then power SW/B can be removed completed now
20. remove screw *2 for power board
21. remove M/B screw *2, then M/B can be removed completely
22. M/B & Power board can be separate now
23. DDR can be removed from M/B now
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP TOUCHSMART TM2 Specifications

General

Bus type	DMI
Stepping	K0
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	1.33 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	18 W
CPU multiplier (bus/core ratio)	10
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Internal memory	3 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	320 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	12.1 \
Touch technology	Multi-touch
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Ethernet interface type	Gigabit Ethernet
Operating temperature (T-T)	41 - 95 °F
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	166 MHz
On-board graphics card dynamic frequency (max)	500 MHz
Audio system	Dolby Advanced
Speakers manufacturer	Altec Lansing
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit LAN, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Keyboard layout	-
Pointing device	Clickpad
Operating system installed	Windows 7 Home Premium
Form factor	Convertible (Swivel)
Product type	Hybrid (2-in-1)
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Processor code	SLBSL
Processor ARK ID	50028
Processor package size	BGA 34 x 28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2

Weight and Dimensions

Depth	326 mm
Width	230 mm
Weight	1893 g
Height (rear)	30 mm
Height (front)	24.3 mm