EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press tenon on the rear cover and remove stand, then relief base tenon to separate base and stand.
2. Unscrew rear cover and downside screws, then remove rear cover with opening plastic picks.
3. Remove Key pad PCB/panel power wire/FFC by hand and unscrews metal casing screws with Cross screwdriver.
4. Unscrew PCB board and I/O port screws by cross screwdriver and hexagon screwdriver.
5. Remove Alu tape, acetate tape and Milar sheet from metal casing by hand.
6. Remove internal wire from main PCB board, remove FFC wire by hand.
7. Remove front metal bezel with opening plastic picks.
8. Unscrew base metal screws by screwdriver and separate base metal and base plastic, unscrew hinge screws by
screwdriver
9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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