HP Z240 User Manual

CPU (processor) and CPU heatsink
CAUTION: Observe the following cautions when removing or replacing the heatsink.
— When removing the heatsink, loosen all screws a little at a time to make sure the CPU remains level. Do not
fully loosen one screw, and then move on to the next.
— After you remove the CPU heatsink from the chassis, use alcohol and a soft cloth to clean the thermal
compound residue from the CPU and the heatsink, allowing the alcohol on the CPU and CPU heatsink to dry
completely.
— If you are reusing the original heatsink, apply thermal compound to the center of the CPU top surface.
— If you are using a new CPU heatsink, do not apply thermal compound to the CPU because the new heatsink
already has thermal compound applied to the heatsink surface. Instead, remove the thermal compound
protective liner from the bottom of the new heatsink.
— Do not overtighten the heatsink screws. Overtightening can strip the threads in the chassis.
— Do not fully tighten one screw and then move on to the next. Instead, tighten all screws a little at a time,
ensuring that the CPU remains level.
CAUTION: Observe the following cautions when removing or replacing the CPU.
— If you are installing a second CPU, it must be of the same type as the rst CPU.
— Internal components might be powered even when the computer is o. To prevent damage, disconnect the
computer power cord before you remove or install a component.
— The CPU socket contacts and pads are extremely fragile. Do not touch the CPU socket contacts or the gold
pads underneath the CPU. Use extreme care and handle the CPU only by the edges.
— The CPU socket contacts are delicate and bend easily. To avoid bending the contacts, use extreme care
when installing the CPU in the socket.
— Installing a processor incorrectly can damage the system board. Contact an HP authorized reseller or
service provider to install the processor. If you plan to install the processor yourself, view the entire remove
and replace video before you begin.
— Failure to follow the computer preparation instructions can result in an improperly installed processor,
causing extensive computer damage.
46 Chapter 3 Component replacement information and guidelines

HP Z240 Specifications

General

Chassis type	Tower
Product color	Black
Country of origin	China
Water cooling system	No
Product type	Workstation
Motherboard chipset	Intel® C236
Memory slots	4x DIMM
Internal memory	8 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 4 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Number of HDDs installed	1
On-board graphics card ID	0x191D
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics P530
Graphics card Open GL support	Yes
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Power supply	400 W
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Operating system architecture	64-bit
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Tcase	- °C
Bus type	DMI3
Stepping	R0
Processor cache	8 MB
Processor model	E3-1245V5
System bus rate	8 GT/s
Processor series	Intel Xeon E3-1200 v5
Processor socket	LGA 1151 (Socket H4)
Processor threads	8
Processor codename	Skylake
Processor frequency	3.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	- W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.9 GHz
PCI Express configurations	1x16, 1x8+2x4, 2x8
Thermal Design Power (TDP)	80 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Scalability	1S
Processor ARK ID	88173
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Secure Key Technology version	1.00

Weight and Dimensions

Depth	442 mm
Width	170 mm
Height	399 mm
Weight	8600 g