HP Z8 G4 Product End-Of-Life Disassembly Instructions

EL-MF877-00
Template Revision B
Page 2
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T-15/T30/
PH2/PH0/V6
Pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove/disengage any security devices that prohibit opening the workstation
2. Disconnect the power cord from the electrical outlet and then from the workstation.
3. Disconnect all peripheral device cables from the workstation.
4. Remove the access panel.(see Figure 1 below)
5. Remove the internal parts.(see Figure 2-4 below)
6. Remove the system fans and brackets. (see Figure 5-19 below)
7. Remove the Slim ODD and cable.(see Figure 20-24 below
8. Remove all the FIO cable from chassis.(see Figure 25-34)
9. Remove all the installed parts from MB.(see Figure 35-36)
10. Remove the CPU cooler.(see figure 37-42)
11. Remove the FIO module.(see fugure 43-55)
12. Remove the HDD bracket.(see figure 56-58)
13. Remove the MB from chassis.(see figure 59-64)
14. Remove the PCIe slot cover.(see figure 65)
15. Remove the PSU.(see figure 66)
16. Remove the right side panel.(see figure 67-70)
17. Remove the PDB out of chassis.(see figure 71-73)
18. Remove the BM SATA cable.(see figure 74-76)
19. Remove the top panel from chassis.(see figure 77-78)
20. Remove the front panel from chassis.(see figure 79-80)
21. Remove the hood sensor bracket and HDD Deco bracket.(see figure 81-82)
22. Remove the front handle pocket.(see figure 83-91)
23. Remove the rear handle pocket.(see figure 92-95)
24. Remove the ODD bracket cover.(see figure 96-100)
25. Remove PSU outside screws.(see figure 101-102)
26. Remove PSU PCB screws.(see figure 103-104)
27. Cutoff the cable tie inside PSU.(see figure 105-108)
28. Disconnector fan header from PSU PCA. (see figure 109-110)
29. Remove the capacitors over 2.5mm. (see figure 111-112)
30. Remove 2pcs fan from PSU. (see figure 113)

HP Z8 G4 Specifications

General

Display included	No
Keyboard included	Yes
Power supply	1125 W
Operating system architecture	64-bit
Audio chip	Realtek ALC221
Product type	Workstation
Market positioning	Business
Motherboard chipset	Intel C622
Chassis type	Tower
Product color	Black
Country of origin	China
Number of 3.5\" bays	4
Number of 5.25\" bays	2
PCI Express x8 slots	3
Headphone outputs	1
HDMI ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Memory slots	24x DIMM
Internal memory	8 GB
Memory channels	Hepta-channel
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tcase	77 °C
Stepping	U0
Processor cache	11 MB
Processor model	4108
System bus rate	- GT/s
Processor socket	LGA 3647 (Socket P)
Processor threads	16
Processor codename	Skylake
Processor frequency	1.8 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3 GHz
Thermal Design Power (TDP)	85 W
Maximum number of PCI Express lanes	48
Memory clock speeds supported by processor	2400 MHz
Maximum internal memory supported by processor	768 GB
Scalability	2S
Processor code	SR3GJ
Processor ARK ID	123544
Intel TSX-NI version	1.00
Processor package size	76.0 x 56.5 mm
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2

Weight and Dimensions

Depth	551.2 mm
Width	215.9 mm
Height	444.5 mm
Weight	22400 g