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Lenovo THINKPAD L470 User Manual

Lenovo THINKPAD L470
176 pages
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Lenovo THINKPAD L470 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack
Housing materialAcrylonitrile butadiene styrene (ABS)
Market positioningBusiness
Windows keysYes
Numeric keypadNo
Pointing deviceThinkPad UltraNav
Operating system architecture64-bit
Memory slots2x SO-DIMM
Internal memory8 GB
Memory form factorSO-DIMM
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Memory layout (slots x size)1 x 8 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Total storage capacity256 GB
Compatible memory cardsMMC, SD, SDHC, SDXC
Number of SSDs installed1
Screen shapeFlat
Display surfaceMatt
Display diagonal14 \
Display brightness250 cd/m²
Native aspect ratio16:9
Contrast ratio (typical)700:1
Intel segment taggingHome Office, Small Business
On-board graphics card ID0x5916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 620
On-board graphics card familyIntel® HD Graphics
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Battery capacity48 Wh
Number of battery cells6
Password protection typeHDD, Power on, Supervisor
Audio chipRealtek ALC3268
Speaker power1 W
Number of built-in speakers2
Front camera HD typeHD
Front camera resolution1280 x 720 pixels
Front camera signal format720p
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.1
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
Sustainability certificatesRoHS, EPEAT Gold, ENERGY STAR
Bus typeOPI
SteppingH0
Tjunction100 °C
Processor cache3 MB
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor socketBGA 1356
Processor threads4
Processor codenameKaby Lake
Configurable TDP-up25 W
Processor frequency2.5 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.1 GHz
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.7 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
AC adapter power45 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
Processor codeSR2ZU
Processor ARK ID95443
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Motherboard chipsetIntel SoC
Weight and Dimensions IconWeight and Dimensions
Depth235 mm
Width339 mm
Height23.9 mm
Weight2020 g

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