SERVICE MANUAL
Copyright (c) NEXO S.A. All rights reserved. PDF ´09.10
PA
011947
■ CONTENTS
(目次)
PANEL LAYOUT
(パネルレイアウト)
...........................................................3
CIRCUIT BOARD LAYOUT
(ユニットレイアウト)
........................................4
SERVICE PRECAUTIONS
(サービス時の注意)
............................................5
OVERALL ASSEMBLY WIRING
(総組立配線図)
..........................................7
DISASSEMBLY PROCEDURES
(分解手順)
...............................................25
LSI PIN DESCRIPTION
(LSI 端子機能表)
...................................................37
IC BLOCK DIAGRAM
(IC ブロック図)
.......................................................38
CIRCUIT BOARDS
(シート基板図)
.............................................................44
TEST PROGRAM .......................................................................................64
テストプログラム
........................................................................................71
INSPECTIONS ...........................................................................................78
検査
.............................................................................................................83
UPDATING THE FIRMWARE .....................................................................88
ファームウェアのアップデート
....................................................................90
PARTS LIST
BLOCK DIAGRAM
IC & DIODE FIGURES
CIRCUIT DIAGRAM