SERVICE MANUAL
PANEL LAYOUT .......................................................................................... 3
CIRCUIT BOARD LAYOUT ......................................................................... 4
SERVICE PRECAUTIONS ........................................................................... 5
OVERALL ASSEMBLY WIRING .................................................................. 7
DISASSEMBLY PROCEDURES ................................................................ 17
LSI PIN DESCRIPTION .............................................................................. 26
IC BLOCK DIAGRAM ................................................................................ 27
CIRCUIT BOARDS ..................................................................................... 33
TEST PROGRAM ....................................................................................... 52
INSPECTIONS ........................................................................................... 59
UPDATING THE FIRMWARE .................................................................... 64
PARTS LIST
IC & DIODE FIGURES
BLOCK DIAGRAM
CIRCUIT DIAGRAM
■ CONTENTS
Copyright (c) NEXO S.A. All rights reserved. PDF ’ 08.01
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