Alienware 15 R2 User Manual

UPMIDIAS
11 Turn the computer over.
Post-requisites
1 Replace the display assembly.
2 Replace the hinge covers.
3 Follow the procedure from step 5 to step 11 in “Replacing the palm rest”.
4 Replace the wireless card.
5 Replace the solid-state drives.
6 Replace the memory modules.
7 Replace the base panel.
Entering the Service Tag in the BIOS
setup program
1 Turn on the computer.
2 Press F2 when the DELL logo is displayed to enter the BIOS setup program.
3 Navigate to the Main tab and enter the Service Tag in the Service Tag
Input field.
119

Alienware 15 R2 Specifications

General

Bus type	DMI3
Stepping	R0
Tjunction	100 °C
Processor cache	6 MB
Processor cores	4
Processor model	i7-6700HQ
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6700 Mobile series
Processor socket	BGA 1440
Processor threads	8
Processor codename	Skylake
Processor frequency	2.6 GHz
Processor cache type	Smart Cache
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	45 W
Maximum number of PCI Express lanes	16
CUDA cores	1280
On-board graphics card ID	0x191B
Discrete graphics card model	NVIDIA® GeForce® GTX 970M
On-board graphics card model	Intel® HD Graphics 530
Discrete graphics card memory	3 GB
Discrete graphics memory type	GDDR5
Graphics card Open GL support	Yes
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
Number of discrete graphics cards supported	1
On-board graphics card dynamic frequency (max)	1050 MHz
Processor code	SR2FQ
Processor ARK ID	88967
Processor package size	42 x 28 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Smart Connect Technology	-
Intel Smart Response Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00
Maximum internal memory (64-bit)	16 GB
Intel® Virtualization Technology (Intel® VT)	VT-x, VT-d
Form factor	Clamshell
Product type	Laptop
Product color	Black, Silver
Market positioning	Gaming
Memory slots	2x SO-DIMM
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	2 x 8 GB
HDD size	2.5 \
HDD speed	7200 RPM
HDD capacity	1000 GB
SSD capacity	256 GB
HDD interface	SATA
SSD interface	PCI Express
Storage media	HDD+SSD
Total storage capacity	1256 GB
Compatible memory cards	SD, SDHC, SDXC
Pixel pitch	0.179 x 0.179 mm
Display surface	Matt
Display diagonal	15.6 \
Display brightness	220 cd/m²
Native aspect ratio	16:9
Audio system	Creative Sound Core3D-EX + Creative Sound Blaster X-Fi MB3
Speaker power	1.5 W
Number of built-in speakers	2
Video capturing speed	30 fps
Front camera resolution (numeric)	2.1 MP
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.1
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Pointing device	Touchpad
Battery voltage	14.8 V
Battery capacity	92 Wh
Battery life (max)	7 h
Battery recharge time	4 h
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cable lock slot type	Noble
Operating shock	110 G
Operating altitude	-15.2 - 3048 m
Non-operating shock	160 G
Operating vibration	0.66 G
Non-operating altitude	-15.2 - 10668 m
Non-operating vibration	1.3 G
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	0 - 35 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	270.2 mm
Width	385.8 mm
Height	34 mm
Weight	3207 g