Thermal Specifications Chapter: Technical Data
Beckhoff New Automation Technology CB3064-xxxx page 117
8.3 Thermal Specifications
The board is specified to operate in an environmental temperature range from 0°C to +60°C (extended
temperature on request). Maximum die temperature is 100°C. To keep the processor under this threshold
an appropriate cooling solution needs to be applied. This solution has to take typical and maximum power
consumption into account. The maximum power consumption may be twice as high and should be used
as a basis for the cooling concept. Additional controllers may also affect the cooling concept. The power
consumption of such components may be comparable to the consumption of the processor.
The board design includes thermal solution mounting points that will provide the best possible thermal
interface between die and solution. Since we take thermal solutions seriously we have several advanced,
aggressive cooling solutions in our product portfolio. Please contact your sales representative to order or
discuss your thermal solution needs.
Do not exceed the maximum Die temperature!
The end customer has the responsibility to ensure that the die temperature of the
processor does not exceed 100°C. Permanent overheating may destroy the
board!
In case the temperature exceeds 100°C the environmental temperature must be
reduced. Under certain circumstances sufficient air circulation must be provided.
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