Contents
page 4 Beckhoff New Automation Technology CB3064-xxxx
6.3 Advanced .................................................................................................................................... 40
6.3.1 Platform Misc Configuration Configuration ......................................................................... 42
6.3.2 CPU Configuration .............................................................................................................. 46
6.3.3 Intel(R) I210 Gigabit Network Connection .......................................................................... 51
6.3.4 Intel(R) Ethernet Connection I219-LM ................................................................................ 53
6.3.5 Driver Health ....................................................................................................................... 54
6.3.6 Trusted Computing ............................................................................................................. 57
6.3.7 ACPI Settings...................................................................................................................... 58
6.3.8 H/W Monitor ........................................................................................................................ 59
6.3.9 Serial Port Console Redirection.......................................................................................... 61
6.3.10 PCI Subsystem Settings ..................................................................................................... 62
6.3.11 Network Stack Configuration .............................................................................................. 64
6.3.12 Power Controller Options .................................................................................................... 65
6.3.13 Compatibility Support Module Configuration ...................................................................... 67
6.3.14 NVMe Controller and Drive Information .............................................................................. 68
6.3.15 USB Configuration .............................................................................................................. 69
6.3.16 SATA and RST Configuration ............................................................................................. 70
6.3.17 AMT Configuration .............................................................................................................. 74
6.4 Chipset ........................................................................................................................................ 80
6.4.1 System Agent (SA) Configuration ....................................................................................... 81
6.4.2 PCH-IO Configuration ......................................................................................................... 86
6.5 Security ..................................................................................................................................... 104
6.5.1 Secure Boot Menu ............................................................................................................ 105
6.6 Boot ........................................................................................................................................... 107
6.6.1 Fixed Boot Order Priority .................................................................................................. 109
6.7 Save & Exit ............................................................................................................................... 110
6.8 BIOS Update ............................................................................................................................. 111
7 Mechanical Drawings ....................................................................................................................... 112
7.1 PCB: Mounting Holes ............................................................................................................... 112
7.2 PCB: Pin 1 Dimensions ............................................................................................................ 113
7.3 PCB: DIE Center ....................................................................................................................... 114
7.4 PCB: Outlines ........................................................................................................................... 115
8 Technical Data ................................................................................................................................. 116
8.1 Electrical Data ........................................................................................................................... 116
8.2 Environmental Conditions ......................................................................................................... 116
8.3 Thermal Specifications ............................................................................................................. 117
9 Support and Service ........................................................................................................................ 118
9.1 Beckhoff's Branch Offices and Representatives ...................................................................... 118
9.2 Beckhoff Support ...................................................................................................................... 118
9.3 Beckhoff Service ....................................................................................................................... 118
9.4 Beckhoff Headquarters ............................................................................................................. 118
I Annex: Post-Codes .......................................................................................................................... 120
II Annex: Resources ............................................................................................................................ 121
Interrupt ................................................................................................................................................ 121
PCI Devices .......................................................................................................................................... 121
Resources: SMB-Devices .................................................................................................................... 122