Cisco UCS B200 M4 Servicing Guide

CPU 2 Installed SlotsCPU 1 Installed SlotsDIMMs Per CPU
E1, F1A1, B12
E1, F1, G1A1, B1, C13
E1, F1, G1, H1A1, B1, C1, D14
E1, F1, G1, H1, E2, F2, G2, H2A1, B1, C1, D1, A2, B2, C2, D28
E1, F1, G1, H1, E2, F2, G2, H2,
E3, F3, G3, H3
A1, B1, C1, D1, A2, B2, C2, D2,
A3, B3, C3, D3
12
System performance is optimized when the DIMM type and quantity are equal for both CPUs, and when each
populated channel is filled equally across the CPUs in the server.
Note
Table 2: Supported DIMM Population Order (Mirroring)
CPU 2 Installed SlotsCPU 1 Installed SlotsDIMMs per CPU
E1, F1A1, B12
E1, F1, G1, H1A1, B1, C1, D14
E1, F1, G1, H1, E2, F2, G2, H2A1, B1, C1, D1, A2, B2, C2, D28
E1, F1, E2, F2A1, B1, C1, D1, A2, B2, C2, D28 (CPU1)
and 4 (CPU2)
Not recommended for performance
reasons.
E1, F1, G1, H1, E2, F2, G2, H2,
E3, F3, G3, H3
A1, B1, C1, D1, A2, B2, C2, D2,
A3, B3, C3, D3
12
Memory Performance
When considering the memory configuration of the blade server, there are several things to consider. For
example:
• When mixing DIMMs of different densities (capacities), the highest density DIMM goes in slot 1 then
in descending density.
• Besides DIMM population and choice, the selected CPU(s) can have some effect on performance.
• DIMMs can be run in a 1DPC, a 2DPC, or a 3DPC configuration. 1DPC and 2DPC can provide the
maximum rated speed that the CPU and DIMMs are rated for. 3DPC causes the DIMMs to run at a slower
speed.
Servicing a Blade Server
16
Servicing a Blade Server
Memory Performance

Cisco UCS B200 M4 Specifications

General

Tcase	72.1 °C
Bus type	QPI
Stepping	R2
FSB Parity	No
Scalability	2S
Processor code	SR206
Processor cache	20 MB
Processor cores	8
Processor model	E5-2630V3
System bus rate	8 GT/s
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Processor threads	16
Processor codename	Haswell
Motherboard chipset	Intel C610
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	52.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	AVX
Thermal Design Power (TDP)	85 W
Compatible processor series	Intel® Xeon®
Supported processor sockets	LGA 2011-v3 (Socket R)
Number of processors installed	2
Maximum number of PCI Express lanes	40
Memory types supported by processor	DDR4-SDRAM
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	1600, 1866 MHz
Memory bandwidth supported by processor (max)	59 GB/s
Maximum internal memory supported by processor	768 GB
Memory slots	24x DIMM
Internal memory	- GB
Memory clock speed	2400 MHz
Number of DIMM slots	24
Supported DIMM module capacities	64GB
USB 2.0 ports quantity	0
Ethernet LAN (RJ-45) ports	-
Power supply	- W
Safety	UL 60950-1 No. 21CFR1040 Second Edition, CAN/CSA-C22.2 No. 60950-1 Second Edition, IEC 60950-1 Second Edition, EN 60950-1 Second Edition, IEC 60950-1 Second Edition, AS/NZS 60950-1, GB4943 2001
Operating altitude	0 - 3000 m
Non-operating altitude	0 - 12000 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 93 %
Ethernet interface type	40 Gigabit Ethernet
RAID levels	0, 1
HDD interface	SATA
Storage controller	LSI SAS3108
Total storage capacity	0 GB
Compatible memory cards	SD
Maximum storage capacity	3.2 TB
Storage drive sizes supported	2.5 \
Supported storage drive types	HDD & SSD
Supported storage drive interfaces	PCI Express, Serial ATA
PCI Express slots version	3.0
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Heat sink	UCSB-HS-EP-M4-F=, UCSB-HS-EP-M4-R=, UCSX-HSCK=
Chassis type	Rack
Cooling type	Active
Product color	Gray
LED indicators	Network, Power
Number of fans	8 fan(s)
Processor ARK ID	83356
Intel Secure Key Technology version	1.00
PC health monitoring	LED
Sustainability certificates	Network Equipment Building Standards (NEBS)

Weight and Dimensions

Depth	620 mm
Width	203 mm
Height	50 mm