Dell XPS 8910 User Manual

GUID-E3EA090A-B05F-48E9-BAE2-39257A9A7FEC
Removing blower and heat-sink
assembly
WARNING: Before working inside your computer, read the safety
information that shipped with your computer and follow the steps in Before
working inside your computer. After working inside your computer, follow
the instructions in After working inside your computer. For more safety best
practices, see the Regulatory Compliance home page at www.dell.com/
regulatory_compliance.
WARNING: The heat sink may become hot during normal operation. Allow
sucient time for the heat sink to cool before you touch it.
CAUTION: For maximum cooling of the processor, do not touch the heat
transfer areas on the heat sink. The oils in your skin can reduce the heat
transfer capability of the thermal grease.
GUID-B44A0F8E-5AB1-468A-9753-729EA3C24BD1
Prerequisites
1 Remove the right-side cover.
2 Follow the procedure from step 1 to step 2 in “Removing the power-supply unit”.
GUID-69E0BF9D-8CB9-4A3E-AF56-77DADF960557
Procedure
1 Remove the screws that secure the blower to the heat-sink assembly.
91

Dell XPS 8910 Specifications

General

Memory slots	4x DIMM
Internal memory	16 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	1 x 16 GB
HDD size	3.5 \
HDD speed	7200 RPM
HDD interface	SATA III
Storage media	HDD
Optical drive type	Blu-Ray RW
Card reader integrated	Yes
Total storage capacity	2000 GB
Compatible memory cards	SD, SDHC, SDXC
Number of storage drives installed	1
Operating system architecture	64-bit
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
DVI port	No
USB 2.0 ports quantity	2
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	7
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Audio chip	Realtek ALC3861
Audio system	Waves MaxxAudio Pro
Product type	PC
Motherboard chipset	Intel® Z170
Audio output channels	7.1 channels
Chassis type	Tower
Product color	Black
Placement supported	Vertical
Power supply input voltage	100 - 240 V
Power supply input frequency	50 - 60 Hz
Operating altitude	-15.2 - 3048 m
Non-operating altitude	-15.2 - 10668 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Cables included	AC
Tcase	71 °C
Bus type	DMI3
Stepping	R0
Processor cache	8 MB
Processor cores	4
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6700 Desktop series
Processor socket	LGA 1151 (Socket H4)
Processor threads	8
Processor codename	Skylake
Processor frequency	3.4 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	4 GHz
PCI Express configurations	2x8, 1x8+2x4, 1x16
Thermal Design Power (TDP)	65 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
On-board graphics card ID	1912
Discrete graphics card model	AMD Radeon RX 480
On-board graphics card model	Intel® HD Graphics 530
Discrete graphics card memory	8 GB
Discrete graphics memory type	GDDR5
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Scalability	1S
Processor code	SR2BT
Processor ARK ID	88196
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, AVX 2.0, SSE4.2
Thermal solution specification	PCG 2015C
Intel Secure Key Technology version	1.00

Weight and Dimensions

Depth	356 mm
Width	180 mm
Height	389 mm
Weight	10000 g