HP Elite x2 1012 G2 User Manual

Requirements for specic countries and regions
Country/region Accredited agency Applicable note number
Argentina IRAM 1
Australia SAA 1
Austria OVE 1
Belgium CEBEC 1
Brazil ABNT 1
Canada CSA 2
Chile IMQ 1
Denmark DEMKO 1
Finland FIMKO 1
France UTE 1
Germany VDE 1
India ISI 1
Israel SII 1
Italy IMQ 1
Japan JIS 3
The Netherlands KEMA 1
New Zealand SANZ 1
Norway NEMKO 1
The People's Republic of China CCC 4
Saudi Arabia SASO 7
Singapore PSB 1
South Africa SABS 1
South Korea KTL 5
Sweden SEMKO 1
Switzerland SEV 1
Taiwan BSMI 6
Thailand TISI 1
The United Kingdom ASTA 1
The United States UL 2
1. The exible cord must be Type HO5VV-F, 3-conductor, 0.75 mm² conductor size. Power cord set ttings (appliance coupler and
wall plug) must bear the certication mark of the agency responsible for evaluation in the country or region where it will be used.
2. The exible cord must be Type SVT/SJT or equivalent, No. 18 AWG, 3-conductor. The wall plug must be a two-pole grounding type
with a NEMA 5-15P (15 A, 125 V ac) or NEMA 6-15P (15 A, 250 V ac) conguration. CSA or C-UL mark. UL le number must be on
each element.
Requirements for specic countries and regions 71

HP Elite x2 1012 G2 Specifications

General

Form factor	Convertible (Detachable)
Product type	Hybrid (2-in-1)
Product color	Silver
Country of origin	China
Display diagonal	12.3 \
Touch technology	Multi-touch
Display resolution	2736 x 1824 pixels
Native aspect ratio	3:2
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	4 MB
Processor cores	2
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-7600 Mobile Series
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.8 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.9 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x2, 1x4, 2x2, 2x1, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.9 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Internal memory	8 GB
Memory clock speed	1866 MHz
Internal memory type	LPDDR3-SDRAM
Maximum internal memory	16 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe 3.0, PCI Express
Storage media	SSD
SSD form factor	M.2
Total storage capacity	512 GB
Compatible memory cards	MicroSD (TransFlash)
Number of SSDs installed	1
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Battery capacity	47 Wh
Battery life (max)	10 h
Video capturing speed	30 fps
Front camera resolution	1920 x 1080 pixels
Front camera signal format	1080p
Rear camera resolution (numeric)	8 MP
Front camera resolution (numeric)	5 MP
AC adapter power	65 W
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.2
Mobile network generation	4G
Sustainability certificates	ENERGY STAR
Charging port type	DC-in jack
USB 2.0 ports quantity	0
Pointing device	Clickpad
Processor code	SR33Z
Processor ARK ID	97466
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Height	14.6 mm
Weight	1150 g
Depth (tablet mode)	219.7 mm
Width (tablet mode)	300 mm
Height (tablet mode)	9.1 mm
Weight (tablet mode)	800 g