HP PROBOOK 4530S User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt
silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, and then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines
described in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Preliminary replacement requirements 43

HP PROBOOK 4530S Specifications

General

Operating temperature (T-T)	5 - 35 °C
Operating system installed	Windows 7 Professional
Operating system architecture	64-bit
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
HDD speed	7200 RPM
HDD interface	SATA II
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	320 GB
Bus type	DMI
Stepping	J1
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-2310M
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-2300 Mobile Series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Sandy Bridge
Processor frequency	2.1 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	21
Maximum number of PCI Express lanes	16
Display surface	Matt
Display diagonal	15.6 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Power supply type	AC
Intel segment tagging	Enterprise
Audio system	Premium Sound
Pointing device	Touchpad
Bluetooth version	3.0+HS
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Firewire (IEEE 1394) ports	0
AC adapter power	65 W
Number of battery cells	6
Sustainability certificates	ENERGY STAR
On-board graphics card ID	0x116
Discrete graphics card model	Intel® HD Graphics 3000
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1100 MHz
Processor code	SR04S
Processor ARK ID	52220
Processor package size	37.5 x 37.5 xrPGA988B); 31 x 24 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00
Country of origin	China

Weight and Dimensions

Depth	256 mm
Width	374 mm
Height	28.7 mm
Weight	2360 g