HP ProBook 6450b User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt
silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the device when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described
in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
74 Chapter 4 Removal and replacement procedures

HP ProBook 6450b Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	2 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-500 Mobile Series
Processor socket	BGA 956
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.93 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	18
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM57 Express
HDD speed	7200 RPM
HDD interface	SATA II
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	250 GB
Number of HDDs installed	1
Display diagonal	14 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Power supply type	AC/DC
Intel segment tagging	Enterprise
Operating temperature (T-T)	41 - 95 °F
Compliance industry standards	IEEE802.3, IEEE802.3u, IEEE802.3ab
Memory slots	2x SO-DIMM
Internal memory	2 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Pointing device	Touchpad
Wi-Fi standards	802.11a, 802.11b, 802.11g
Bluetooth version	2.1+EDR
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
Operating system installed	Windows 7 Professional
Operating system architecture	32-bit
ExpressCard slot	-
Charging port type	DC-in jack
USB 2.0 ports quantity	3
CardBus PCMCIA slots quantity	0
AC adapter power	65 W
Battery capacity	55 Wh
Number of battery cells	6
Storage relative humidity (H-H)	5 - 95 %
Product color	Black, Silver
Country of origin	China
Discrete graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Processor ARK ID	47341
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1/4.2
Intel® Turbo Boost Technology	1.0
Physical Address Extension (PAE)	36 bit

Weight and Dimensions

Depth	236.2 mm
Width	339 mm
Height	33.8 mm
Weight	2260 g