HP ProLiant MicroServer Gen8 User Manual

Hardware options installation 44
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options and
identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
Bezel faceplate
Use the interchangeable, colored bezel faceplates in this option kit to customize the look of your server.
• Decorative purpose—Choose the faceplate color that complements your office environment.
• Functional purpose—In a multiserver office, use different colored faceplates to identify a server unit,
based on the assigned function.
For more information about product features, specifications, options, configurations, and compatibility, see
the product QuickSpecs on the HP website (http://www.hp.com/go/qs).
To install the component:
Perform steps 1 to 3 only if the front bezel is secured from inside the chassis.
1. Power down the server (on page 14).
2. Disconnect the power cord from the AC source.
3. Disconnect the power cord from the server.
4. Remove the front bezel (on page 16).
5. Remove the screws securing the bezel frame to the attached bezel faceplate.

HP ProLiant MicroServer Gen8 Specifications

General

Tcase	65.3 °C
Bus type	DMI
FSB Parity	No
Processor cache	3 MB
Processor cores	2
Processor model	i3-3240
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor threads	4
Processor codename	Ivy Bridge
Motherboard chipset	Intel® C204
Processor frequency	3.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal Design Power (TDP)	55 W
Supported processor sockets	LGA 1155 (Socket H2)
Number of processors installed	1
Thermal solution specification	PCG 2011C
CPU multiplier (bus/core ratio)	34
Thermal Monitoring Technologies	Yes
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
RAID levels	0, 1, 10
HDD interface	Serial ATA
Optical drive type	DVD±RW
Total storage capacity	1000 GB
Maximum storage capacity	12 TB
Memory slots	2x DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
On-board graphics card ID	0x152
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Power supply	200 W
Chassis type	Ultra Micro Tower
Serial ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Operating system installed	-
Compatible operating systems	Microsoft Windows Server Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware
Processor ARK ID	65690
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	245 mm
Width	230 mm
Height	232.4 mm
Weight	9800 g