HP Z2 SFF G5 User Manual

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Hexagon Screw Driver
T-15
Crisscross Screw Driver
PH1
Electric Iron
QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Open access panel
2. Remove Front Bezel from chassis
3 Press the Graphic card’s latch
4 Unplug Graphic card
5. Loose the screws of HDD and remove HDD from HDD cage
6. Disconnect HDD power cable and HDD SATA cable from HDD
7. Disconnect all cables from MB
8. Remove the driver cage from Chassis
9. Disconnect system fan cable from MB
10. Disconnect cooler fan cable from MB
11. Remove the Fan duct from cooler
12. Use T-15 screwdriver to loose the screws and remove cooler
13. Use PH1 screwdriver to loose the screws and remove the fan
14. Separate the fan from cooler
15. Remove memory from MB
16. Rotate the handle and open it up
17. Remove the CPU from the board
18. Remove the battery from the system board
19. Remove speaker from Chassis
20. Remove WLAN M.2 Card
21. Use T-15 screwdriver remove the screws on the PSU Chassis
22. Disconnect the PSU cable from the MB
23. Use T-15 screwdriver to loose the screws of MB from board
24. Remove MB from chassis
25. Press the PSU’s latch on chassis
26. Remove the PSU from chassis
27. Use PH1 screwdriver to remove screw for the PSU
28. Remove cover

HP Z2 SFF G5 Specifications

General

SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
SSD memory type	TLC
Optical drive type	No
Card reader integrated	Yes
Total storage capacity	256 GB
Compatible memory cards	SD
Number of SSDs installed	1
Chassis type	SFF
Product color	Black
Product type	Workstation
Market positioning	Business
Operating system installed	Windows 10 Pro for Workstations
Operating system architecture	64-bit
Discrete GPU manufacturer	NVIDIA
On-board graphics card ID	0x9BC8
Discrete graphics card model	NVIDIA® Quadro® P620
On-board graphics card model	Intel® UHD Graphics 630
Discrete graphics card memory	2 GB
Discrete graphics memory type	GDDR5
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
HP Management tools	HP PC Hardware Diagnostics UEFI; HP Performance Advisor; HP Support Assistant; HP PC Hardware Diagnostics Windows; ZCentral Remote Boost; HP Image Assistant; HP Manageability Integration Kit
Wi-Fi	-
Ethernet LAN data rates	10, 100, 1000 Mbit/s
DisplayPort version	1.4
USB 2.0 ports quantity	2
Thunderbolt 3 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	4
Memory slots	4x DIMM
Internal memory	8 GB
Memory clock speed	3200 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tjunction	100 °C
Processor cache	12 MB
Processor cores	6
Processor model	i5-10500
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1200 (Socket H5)
Processor threads	12
Processor codename	Comet Lake
Processor frequency	3.1 GHz
Processor cache type	L3
Processor lithography	14 nm
PCI Express slots version	3.0
Processor boost frequency	4.5 GHz
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Maximum number of PCI Express lanes	16
Memory clock speeds supported by processor	2666 MHz
Memory bandwidth supported by processor (max)	41.6 GB/s
Maximum internal memory supported by processor	128 GB
Scalability	1S
Processor ARK ID	199277
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Thermal solution specification	PCG 2015C
Graphics card interface	PCIe x16

Weight and Dimensions

Depth	308 mm
Width	338 mm
Height	100 mm
Weight	5400 g