HP Z8 G4 Product End-Of-Life Disassembly Instructions

EL-MF877-00
Template Revision B
Page 1
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Workstations
Marketing Name / Model
[List multiple models if applicable.]
HP Z8 G4 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code
on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact
.
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Yes
5
Batteries All types including standard alkaline and lithium
coin or button style batteries Yes
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Eldorado1450W PSU
9
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
1.0 Items Requiring Selective Treatment

HP Z8 G4 Specifications

General

Display included	No
Keyboard included	Yes
Power supply	1125 W
Operating system architecture	64-bit
Audio chip	Realtek ALC221
Product type	Workstation
Market positioning	Business
Motherboard chipset	Intel C622
Chassis type	Tower
Product color	Black
Country of origin	China
Number of 3.5\" bays	4
Number of 5.25\" bays	2
PCI Express x8 slots	3
Headphone outputs	1
HDMI ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Memory slots	24x DIMM
Internal memory	8 GB
Memory channels	Hepta-channel
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tcase	77 °C
Stepping	U0
Processor cache	11 MB
Processor model	4108
System bus rate	- GT/s
Processor socket	LGA 3647 (Socket P)
Processor threads	16
Processor codename	Skylake
Processor frequency	1.8 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3 GHz
Thermal Design Power (TDP)	85 W
Maximum number of PCI Express lanes	48
Memory clock speeds supported by processor	2400 MHz
Maximum internal memory supported by processor	768 GB
Scalability	2S
Processor code	SR3GJ
Processor ARK ID	123544
Intel TSX-NI version	1.00
Processor package size	76.0 x 56.5 mm
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2

Weight and Dimensions

Depth	551.2 mm
Width	215.9 mm
Height	444.5 mm
Weight	22400 g