Quad-Core Intel® Xeon® Processor 5400 Series TMDG 43
Thermal/Mechanical Reference Design
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B
for the Quad-Core Intel® Xeon® Processor X5400 Series. From Tabl e 2 -7 the three-
sigma (mean+3sigma) performance of the thermal solution is computed to be
0.246°C/W and the processor local ambient temperature (T
LA
) for this thermal solution
is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:
Equation 2-9.y = 0.246*X + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-20 below shows the comparison of this reference thermal solution’s Thermal
Profile to the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile
specification. The 1U CEK solution meets the Thermal Profile B with 0.5°C margin at
the upper end (TDP). However, as explained in Section 2.2.7, designing to Thermal
Profile B results in increased TCC activation and measurable performance loss for the
processor.
Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400
Series Thermal Profile A
40
45
50
55
60
65
0510
15
20 25 30 35 40 45 50 55 60 65 70 75 80
Power (W)
e
pe
t
e
C
)
Thermal Profile A
Y = 0.168 * X + 42.8
2U CEK Reference Solution
Y = 0.187 * X + 40
T
CASE_MAX_B
@ TDP
90 100 110
TDP
120
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