Intel DH55TC User Manual

Technical Reference
57
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 50 ºC. The MTBF for the board is
146,986 hours.
2.8 Environmental
Table 31 lists the environmental specifications for the board.
Table 31. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
-40 °C to +60 °C
Operating
0 °C to +40 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

Intel DH55TC Specifications

Add-in Card Connectors

PCI Express 2.0 x16 transfer speed	8 GB/s
PCI Express 2.0 x1 transfer speed	250 MB/s
Conventional PCI connectors count	1

Front Panel USB Headers

USB 2.0 specification compliance	Yes
+5 V DC power on USB headers	Fused
USB Header 2 Pin 10 routing	HDD LED