MSI GE75 User Manual

User's Manual
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RoHS Statement
Japan JIS C 0950 Material Declaration
A Japanese regulatory requirement, defined by specification JIS C 0950, mandates that
manufacturers provide material declarations for certain categories of electronic products
offered for sale after July 1, 2006.
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
India RoHS
This product complies with the "India E-waste (Management and Handling) Rule 2011"
and prohibits use of lead, mercury, hexavalent chromium, polybrominated biphenyls or
polybrominated diphenyl ethers in concentrations exceeding 0.1 weight % and 0.01 weight
% for cadmium, except for the exemptions set in Schedule 2 of the Rule.
Turkey EEE regulation
Conforms to the EEE Regulations of the Republic Of Turkey.
Ukraine restriction of hazardous substances
The equipment complies with requirements of the Technical Regulation, approved by the
ResolutionofCabinetofMinistryofUkraineasofDecember3,2008№1057,interms
of restrictions for the use of certain dangerous substances in electrical and electronic
equipment.
Vietnam RoHS
As from December 1, 2012, all products manufactured by MSI comply with Circular
30/2011/TT-BCT temporarily regulating the permitted limits for a number of hazardous
substances in electronic and electric products.

MSI GE75 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Black
Market positioning	Gaming
LED backlight	Yes
Display diagonal	17.3 \
Native aspect ratio	16:9
Display response rise/fall	3 ms
Memory slots	2x SO-DIMM
Internal memory	16 GB
Memory clock speed	2666 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
HDD capacity	1000 GB
SSD capacity	256 GB
Storage media	HDD+SSD
Total storage capacity	1256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of HDDs installed	1
Motherboard chipset	Intel® HM370
Antenna type	2x2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
On-board graphics card ID	0x3E9B
Discrete graphics card model	NVIDIA® GeForce® GTX 1060
On-board graphics card model	Intel® UHD Graphics 630
Discrete graphics card memory	6 GB
Discrete graphics memory type	GDDR5
Maximum on-board graphics card memory	64 GB
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1100 MHz
Front camera HD type	HD
Video capturing speed	30 fps
Front camera signal format	720p
Speaker power	3 W
Number of built-in speakers	2
Battery capacity	51 Wh
Number of battery cells	6
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Pointing device	Touchpad
Keyboard backlit color	Various
AC adapter power	180 W
Bus type	DMI
Stepping	U0
Tjunction	100 °C
Processor cache	9 MB
Processor model	i7-8750H
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1440
Processor threads	12
Processor codename	Coffee Lake
Processor frequency	2.2 GHz
Processor cache type	Smart Cache
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	4.1 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Thermal Design Power (TDP)	45 W
Configurable TDP-down frequency	1.7 GHz
Maximum number of PCI Express lanes	16
Processor code	SR3YY
Processor ARK ID	134906
Processor package size	42 x 28 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	268.5 mm
Width	397 mm
Height	27.5 mm
Weight	2610 g