— 11 —
3-2. CIRCUIT DIAGRAM
✽ 9. L28~L30 are used as the static drive pins.
✽ 10. L1~L2 are used as the motor drive pins.
✽ 11. CSB is used as the SCUT pin.
✽ 12. The EEPROM of this module is write-protected,
therefore is not writable.
When WP is HIGH, EEPROM is write-protected.
When WP is LOW, EEPROM is writable.
✽ 1. No bonding
✽ 2. GND-KI7: Open (No Soldering)
✽ 3. Latch type key
✽ 4. Short (Soldering) (R, N trimming)
✽ 5. Inclination sensor
✽ 6. GNDB is used for the bias on the back of the tip.
✽ 7. PIN name
✽ 8. Soldering short after the test
LCD (2.8V 1/3b 1/5d)
GND VDD2
VCH
VDD3
VC1 VC2
VDD1
BD
VDSP
VC3 VC4 VHF
VSC
C1
C3C5 C2C4C7
C6
BAT
C8
LL1
Tr1
PZ
Di1
SC
C9
Z
Di2
R1
L
CLF1
E'
L+
VOUT
L–
GND
CLF2
V+
C11
EL
LL2
BACK
FRONT
R3
GNDB
ELD
Xtal
CT
S2
SA
S1
S3
SK
S5
S4
XTB
LD1
XT
T1
T2
T3
KI1
KI2
KI3
KI4
KI5
KI6
KI7
KI9
AC
T4
R1
R2
R3
N1
N2
L3 - - - - L55 LC1 - - - LC5 SDO SCK CSBSDI
An.B1
L1 L2
EEPROM
C10
Tr2
R17
VCCE SCLSDA WP
VSS A1A2 A0
SDA WPSCL VCC
SCR
SCIN
KI8
KC4
KC3
KC2
KC1
VPM
R5R4
C12
SDI
SDO
SCK
T1
CSB
T2
TEST
CS
VADX VREF1VADY
SN5
VTHVAN
VREF4SN6
VREF2
VOS
GND VDD2
ISNS IREF1SN3 SN4
IREF2 L1 L2 VM1 VM2 SN7 CF CR OSC1 OSC3 OSC4 OSC6
C13
RTH
C14
R6 R7
R8 R9
R10
4
3
2
1
C15 C16 C17
R11
R12
R13
Di3
R14
R16
SX
L1
SY
L2
GND
R15
MIS
MIC
LSI (NEW SOI)
TOTAL 106PINS
BONDING 105PINS
LSI2 (Sensor Tip)
TOTAL 36PINS
BONDING 36PINS
✽3
✽2
INV
✽4
✽4
✽4
✽3
✽3
✽3
✽5
+
PS
✽8
✽8
✽8
✽8
✽9
✽7 ✽7
✽3
✽10
✽11
✽4
✽4
✽3
✽3
✽1
✽8
✽12
✽6
✽7
✽7
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