Cisco UCS B200 M4 User Manual

CHAPTER 3
Servicing a Blade Server
This chapter contains the following sections:
•
Drive Replacement, page 11
•
Removing a Blade Server Cover, page 13
•
Air Baffles, page 14
•
Internal Components, page 15
•
Diagnostics Button and LEDs, page 16
•
Installing a CMOS Battery, page 16
•
Installing the Storage Module, page 18
•
Removing a Heat Sink and CPU, page 19
•
Installing a New CPU and Heat Sink, page 20
•
Installing Memory, page 22
•
Installing an mLOM Adapter, page 27
•
Installing an Adapter Card, page 28
•
Installing the nVidia M6 GPU, page 31
•
Enabling the Trusted Platform Module, page 34
Drive Replacement
The modular storage system has two front-accessible drive bays that support hot-swappable, 2.5 inch drives.
If you purchased the UCS B200 M4 blade server without the modular storage system configured as a part of
the system, a pair of blanking panels may be in place. These panels should be removed before installing hard
drives, but should remain in place to ensure proper cooling and ventilation if the drive bays are unused.
You can remove and install hard drives without removing the blade server from the chassis.
The drives supported in this blade server come with the drive sled attached. Spare drive sleds are not available.
A list of currently supported drives is in the specification sheets at this URL:http://www.cisco.com/c/en/us/
products/servers-unified-computing/ucs-b-series-blade-servers/datasheet-listing.html
Cisco UCS B200 M4 Blade Server Installation and Service Note
11

Cisco UCS B200 M4 Specifications

General

Tcase	72.1 °C
Bus type	QPI
Stepping	R2
FSB Parity	No
Scalability	2S
Processor code	SR206
Processor cache	20 MB
Processor cores	8
Processor model	E5-2630V3
System bus rate	8 GT/s
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Processor threads	16
Processor codename	Haswell
Motherboard chipset	Intel C610
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	52.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	AVX
Thermal Design Power (TDP)	85 W
Compatible processor series	Intel® Xeon®
Supported processor sockets	LGA 2011-v3 (Socket R)
Number of processors installed	2
Maximum number of PCI Express lanes	40
Memory types supported by processor	DDR4-SDRAM
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	1600, 1866 MHz
Memory bandwidth supported by processor (max)	59 GB/s
Maximum internal memory supported by processor	768 GB
Memory slots	24x DIMM
Internal memory	- GB
Memory clock speed	2400 MHz
Number of DIMM slots	24
Supported DIMM module capacities	64GB
USB 2.0 ports quantity	0
Ethernet LAN (RJ-45) ports	-
Power supply	- W
Safety	UL 60950-1 No. 21CFR1040 Second Edition, CAN/CSA-C22.2 No. 60950-1 Second Edition, IEC 60950-1 Second Edition, EN 60950-1 Second Edition, IEC 60950-1 Second Edition, AS/NZS 60950-1, GB4943 2001
Operating altitude	0 - 3000 m
Non-operating altitude	0 - 12000 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 93 %
Ethernet interface type	40 Gigabit Ethernet
RAID levels	0, 1
HDD interface	SATA
Storage controller	LSI SAS3108
Total storage capacity	0 GB
Compatible memory cards	SD
Maximum storage capacity	3.2 TB
Storage drive sizes supported	2.5 \
Supported storage drive types	HDD & SSD
Supported storage drive interfaces	PCI Express, Serial ATA
PCI Express slots version	3.0
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Heat sink	UCSB-HS-EP-M4-F=, UCSB-HS-EP-M4-R=, UCSX-HSCK=
Chassis type	Rack
Cooling type	Active
Product color	Gray
LED indicators	Network, Power
Number of fans	8 fan(s)
Processor ARK ID	83356
Intel Secure Key Technology version	1.00
PC health monitoring	LED
Sustainability certificates	Network Equipment Building Standards (NEBS)

Weight and Dimensions

Depth	620 mm
Width	203 mm
Height	50 mm