Cisco UCS C220 M3 Spec Sheet

Cisco UCS Cisco UCS C220 M3 High-Density Rack Server (Large Form Factor Hard Disk Drive Model)
SUPPLEMENTAL MATERIAL
61
Recommended Memory Configuration
This section explains the recommended DIMM population order rules for the C220 M3 server.
■ All DIMMs must be DDR3 DIMMs.
■ Do not mix:
— DIMMs with different clock rates in a channel
— RDIMMs and LRDIMMs
— ECC and non-ECC DIMMs
■ There are blue and black DIMM slots. Populate blue slots first.
■ When single- and dual-rank DIMMs are populated for 2DPC, always populate the dual-rank
DIMM in the blue DIMM slot and the single-rank DIMM in the black DIMM slot.
Many memory configurations are possible. For best results, follow Ta b le 34 when populating 1600- and
1866-MHz DIMMs for Intel Xeon E5-2600 v2 CPUs and Ta b l e 35 when populating 1600-MHz DIMMs for Intel
Xeon E5-2600 CPUs.
Table 34 Recommended Memory Configurations for Intel Xeon E5-2600 v2 CPUs (with 1600- and 1866-MHz DIMMs)
1
To t al
System
Memory
Size
CPU 1 DIMMs CPU 2 DIMMs
DIMM Max
Speed (MHz)
Total DIMMs
Blue Slots
Bank 1
(A1,B1, C1,D1)
Black Slots
Bank 2
(A2,B2, C2,D2)
Blue Slots
Bank 1
(E1,F1, G1,H1)
Black Slots
Bank 2
(E2,F2, G2,H2)
32 GB
4x4 GB — 4x4 GB —
N/A
2
8
2x8 GB — 2x8 GB — 1866 4
64 GB
4x4 GB 4x4 GB 4x4 GB 4x4 GB
N/A
2
16
4x8 GB — 4x8 GB — 1866 8
96 GB 4x8 GB 2x8 GB 4x8 GB 2x8 GB 1866 12
3x16 GB — 3x16 GB — 1866 6
4x8 GB 4x4 GB 4x8 GB 4x4 GB
N/A
2
16
128 GB
4x8 GB 4x8 GB 4x8 GB 4x8 GB 1866 16
4x16 GB — 4x16 GB — 1866 8
192 GB
4x16 GB 2x16 GB 4x16 GB 2x16 GB 1866 12
4x16 GB 4x8 GB 4x16 GB 4x8 GB 1866 16
256 GB
4x16 GB 4x16 GB 4x16 GB 4x16 GB 1866 16
4x32 GB — 4x32 GB — 1866 8

Cisco UCS C220 M3 Specifications

General

Tcase	70 °C
Bus type	QPI
Stepping	M1
FSB Parity	No
Scalability	2S
Processor cache	10 MB
Processor cores	4
System bus rate	6.4 GT/s
Processor series	Intel Xeon E5-2600
Processor socket	LGA 2011 (Socket R)
Processor codename	Sandy Bridge EP
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor manufacturer	Intel
Processor package size	52.5 x 45.0 mm
Processor front side bus	- MHz
Processor boost frequency	2.50 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Graphics & IMC lithography	32 nm
PCI Express configurations	x4, x8, x16
Supported instruction sets	AVX
Thermal Design Power (TDP)	80 W
Number of processors installed	2
CPU multiplier (bus/core ratio)	24
Physical Address Extension (PAE)	46 bit
Maximum number of PCI Express lanes	40
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	750 GB
HDD size	2.5 \
HDD interface	-
Total storage capacity	500 GB
Compatible memory cards	SD
Maximum storage capacity	- TB
Memory slots	16
Internal memory	32 GB
Memory clock speed	1866 MHz
Maximum internal memory	- GB
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	3
Chassis type	Rack (1U)
Power supply	450 W
Safety	UL 60950-1 No. 21CFR1040, CAN/CSA-C22.2 No. 60950-1, IEC 60950-1, EN 60950-1, IEC 60950-1, AS/NZS 60950-1, GB4943 2001
Certification	47CFR Part 15 (CFR 47), AS/NZS CISPR22, CISPR2 2, EN55022, ICES003, VCCI, EN61000-3-2, EN61000-3-3, KN22, CNS13438, EN55024, CISPR24, EN300386, KN24
Operating altitude	0 - 3000 m
Non-operating altitude	0 - 12000 m
Storage temperature (T-T)	-40 - 70 °C
Operating temperature (T-T)	0 - 40 °C
Storage relative humidity (H-H)	5 - 93 %
Operating relative humidity (H-H)	10 - 90 %
PCI Express slots version	3.0
Processor ARK ID	64588
Intel Secure Key Technology version	1.00
Intel Identity Protection Technology version	0.00
Harmonized System (HS) code	84714100

Weight and Dimensions

Depth	724 mm
Width	430 mm
Height	43.2 mm