Cisco UCS C220 M3 User Manual

Cisco UCS Cisco UCS C220 M3 High-Density Rack Server (Small Form Factor Disk Drive Model)
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SUPPLEMENTAL MATERIAL
CPUs and DIMMs
Physical Layout
Each CPU has four DIMM channels:
■ CPU1 has channels A, B, C, and D
■ CPU2 has channels E, F, G, and H
Each DIMM channel has two banks: bank 1 and bank 2. The blue-colored DIMM banks are for bank 1 and the
black-colored are for bank 2.
As an example, DIMM slots A1, B1, C1, and D1 belong to bank 1, while A2, B2, C2, and D2 belong to bank 2.
Figure 7 shows how banks and channels are physically laid out on the motherboard. The DIMM slots on the
right (channels A, B, C, and D) are associated with CPU1, while the DIMM slots on the left (channels E, F, G,
and H) are associated with CPU2. The bank 1 (blue) DIMM slots are always located farther away from a CPU
than the corresponding bank 2 (black) slots. Bank 1 slots (blue) are populated before bank 2 slots (black).
7 CPUs and heatsinks (two) 16 Power supplies (two, hot-swappable
access through rear panel)
8 Integrated RAID on motherboard, and mini-SAS
connectors
17 RTC battery on motherboard
9 Mezzanine RAID card, mini-SAS connectors
SAS1 and SAS2
18 Software RAID 5 header (RAID key).

Cisco UCS C220 M3 Specifications

General

Tcase	70 °C
Bus type	QPI
Stepping	M1
FSB Parity	No
Scalability	2S
Processor cache	10 MB
Processor cores	4
System bus rate	6.4 GT/s
Processor series	Intel Xeon E5-2600
Processor socket	LGA 2011 (Socket R)
Processor codename	Sandy Bridge EP
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor manufacturer	Intel
Processor package size	52.5 x 45.0 mm
Processor front side bus	- MHz
Processor boost frequency	2.50 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Graphics & IMC lithography	32 nm
PCI Express configurations	x4, x8, x16
Supported instruction sets	AVX
Thermal Design Power (TDP)	80 W
Number of processors installed	2
CPU multiplier (bus/core ratio)	24
Physical Address Extension (PAE)	46 bit
Maximum number of PCI Express lanes	40
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Quad
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	750 GB
HDD size	2.5 \
HDD interface	-
Total storage capacity	500 GB
Compatible memory cards	SD
Maximum storage capacity	- TB
Memory slots	16
Internal memory	32 GB
Memory clock speed	1866 MHz
Maximum internal memory	- GB
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	3
Chassis type	Rack (1U)
Power supply	450 W
Safety	UL 60950-1 No. 21CFR1040, CAN/CSA-C22.2 No. 60950-1, IEC 60950-1, EN 60950-1, IEC 60950-1, AS/NZS 60950-1, GB4943 2001
Certification	47CFR Part 15 (CFR 47), AS/NZS CISPR22, CISPR2 2, EN55022, ICES003, VCCI, EN61000-3-2, EN61000-3-3, KN22, CNS13438, EN55024, CISPR24, EN300386, KN24
Operating altitude	0 - 3000 m
Non-operating altitude	0 - 12000 m
Storage temperature (T-T)	-40 - 70 °C
Operating temperature (T-T)	0 - 40 °C
Storage relative humidity (H-H)	5 - 93 %
Operating relative humidity (H-H)	10 - 90 %
PCI Express slots version	3.0
Processor ARK ID	64588
Intel Secure Key Technology version	1.00
Intel Identity Protection Technology version	0.00
Harmonized System (HS) code	84714100

Weight and Dimensions

Depth	724 mm
Width	430 mm
Height	43.2 mm