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Cisco UCS C220 M3 User Manual

Cisco UCS C220 M3
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Cisco UCS Cisco UCS C220 M3 High-Density Rack Server (Small Form Factor Disk Drive Model)
SUPPLEMENTAL MATERIAL
51
Recommended Memory Configuration
This section explains the recommended DIMM population order rules for the C220 M3 server.
All DIMMs must be DDR3 DIMMs.
Do not mix:
DIMMs with different sizes or clock rates in a bank
RDIMMs and LRDIMMs
ECC and non-ECC DIMMs
There are blue and black DIMM slots. Populate blue slots first.
When single- and dual-rank DIMMs are populated for 2DPC, always populate the dual-rank
DIMM in the blue DIMM slot and the single-rank DIMM in the black DIMM slot.
Many memory configurations are possible. For best results, follow Table 27 when populating DIMMs.
Table 27 Recommended Memory Configurations
Total
System
Memory
Size
CPU 1 DIMMs CPU 2 DIMMs
DIMM Max
Operating
Speed
(MHz)
Total
DIMMs in
the
System
1
Blue Slots
Bank 1
(A1, B1,
C1, D1)
Black Slots
Bank 2
(A2, B2,
C2, D2)
Blue Slots
Bank 1
(E1, F1,
G1, H1)
Black Slots
Bank 2
(E2, F2,
G2, H2)
32 GB
4x4 GB 4x4 GB 1600 8
2x8 GB 2x8 GB 1600 4
64 GB
4x4 GB 4x4 GB 4x4 GB 4x4 GB 1600 16
4x8 GB 4x8 GB 1600 8
1x32 GB 1x32GB 1600 2
96 GB
4x8 GB 2x8 GB 4x8 GB 2x8 GB 1600 12
3x16 GB 3x16 GB 1600 6
4x8 GB 4x4 GB 4x8 GB 4x4 GB 1600 16
1x32 GB 1x16 GB 1x32 GB 1x16 GB 1600 4
128 GB
4x8 GB 4x8 GB 4x8 GB 4x8 GB 1600 16
4x16 GB 4x16 GB 1600 8
1x32 GB 1x32GB 1x32 GB 1x32GB 1600 8

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Cisco UCS C220 M3 Specifications

General IconGeneral
Tcase70 °C
Bus typeQPI
SteppingM1
FSB ParityNo
Scalability2S
Processor cache10 MB
Processor cores4
System bus rate6.4 GT/s
Processor seriesIntel Xeon E5-2600
Processor socketLGA 2011 (Socket R)
Processor codenameSandy Bridge EP
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor manufacturerIntel
Processor package size52.5 x 45.0 mm
Processor front side bus- MHz
Processor boost frequency2.50 GHz
Processor operating modes64-bit
ECC supported by processorYes
Graphics & IMC lithography32 nm
PCI Express configurationsx4, x8, x16
Supported instruction setsAVX
Thermal Design Power (TDP)80 W
Number of processors installed2
CPU multiplier (bus/core ratio)24
Physical Address Extension (PAE)46 bit
Maximum number of PCI Express lanes40
Memory types supported by processorDDR3-SDRAM
Memory channels supported by processorQuad
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)34.1 GB/s
Maximum internal memory supported by processor750 GB
HDD size2.5 \
HDD interface-
Total storage capacity500 GB
Compatible memory cardsSD
Maximum storage capacity- TB
Memory slots16
Internal memory32 GB
Memory clock speed1866 MHz
Maximum internal memory- GB
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports3
Chassis typeRack (1U)
Power supply450 W
SafetyUL 60950-1 No. 21CFR1040, CAN/CSA-C22.2 No. 60950-1, IEC 60950-1, EN 60950-1, IEC 60950-1, AS/NZS 60950-1, GB4943 2001
Certification47CFR Part 15 (CFR 47), AS/NZS CISPR22, CISPR2 2, EN55022, ICES003, VCCI, EN61000-3-2, EN61000-3-3, KN22, CNS13438, EN55024, CISPR24, EN300386, KN24
Operating altitude0 - 3000 m
Non-operating altitude0 - 12000 m
Storage temperature (T-T)-40 - 70 °C
Operating temperature (T-T)0 - 40 °C
Storage relative humidity (H-H)5 - 93 %
Operating relative humidity (H-H)10 - 90 %
PCI Express slots version3.0
Processor ARK ID64588
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version0.00
Harmonized System (HS) code84714100
Weight and Dimensions IconWeight and Dimensions
Depth724 mm
Width430 mm
Height43.2 mm

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