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ECS B75H2-AM2 User Manual

ECS B75H2-AM2
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Page #6 background image
2
Introducing the Motherboard
Feature
Accommodates the 2
nd
/3
rd
Generation Intel
®
Ivy/Sandy Bridge proces-
sors
Supports “Hyper-Threading” technology CPU
One PCI Express x16 Gen3 port
The motherboard uses an LGA1155 type of socket that carries the following
features:
Processor
Chipset
Supports DDR3 1600/1333/1066 DDR3 SDRAM with Dual-channel ar-
chitecture
Accommodates four unbuffered DIMMs
Up to 4GB per DIMM with maximum memory size up to 16 GB
Memory
Audio
5.1+2 Channel High Definition Audio Codec
Meets Microsoft Windows Logo Program and Lync audio requirements
All DACs supports 44.1k/48k/96k/192kHz sample rate
Software selectable 2.5V/3.2V/4.0V VREFOUT
Direct Sound 3D
TM
compatible
Power Support: Digital: 3.3V; Analog: 5.0V
The Intel B75 Chipset is a single-chip with proven reliability and performance.
Support one PCI Express x1 slot
Integrated one SATA 6.0 Gb/s Host Controller
Integrated three SATA 3.0 Gb/s Host Controllers
Eight USB 2.0 ports are supported
Serial Peripheral Interface (SPI) support
Integrated Graphics Support with PAVP 3.0
Intel
®
High Definition Audio Controller
LAN
The onboard LAN provides the following features:
Supports PCI Express
TM
1.1
Integrated 10/100/1000 transceiver
Fully compliant with IEEE802.3, IEEE802.3u, IEEE802.3ab
Wake-on-LAN and remote wake-up support
“Hyper-Threading” technology enables the operating system into thinking
it’s hooked up to two processors, allowing two threads to be run in parallel, both
on separate “logical” processors within the same physical processor.

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ECS B75H2-AM2 Specifications

General IconGeneral
BrandECS
ModelB75H2-AM2
CategoryMotherboard
LanguageEnglish

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