HP 415E User Manual

Section V
Paragraphs 5-18 to 5-22
b. If the meter tracking error is greater than 0.02
db, adjust A3R57 (See Figure 5-10) and repeat meas-
urement until meter tracking error is less than
20.02 db.
5-18. REPAIR AND REPLACEMENT.
5-19. Certain procedures and precautions must be
followed when repairing or replacing any component of
the Model 415Е. Most of the amplifier and power
Supply circuit components are located on the etched
circuit board. Instructions for working on the etched
circuit board are summarized in Paragraph 5-20.
Always disconnect the АС or battery power before re-
placing or soldering any parts. Instruction for removal
and replacement of switches is detailed in Paragraph
5-27.
5-20. ETCHED CIRCUITS.
5-21. The etched circuit board in the SWR Meter is of
the plated-through type consisting of metallic сопе
ductors bonded to both sides of insulating material.
Soldering can be done from either side ofthe board with
equally good results. Table 5-3.lists requiredtools and
materials. Following are recommendations and pre-
cautions pertinent to etched circuit repair work.
а. Avoid unnecessary component substitution: it can
result in damage to the circuit board and/or adjacent
components.
b. Do not use а high-power soldering ігоп оп etched
Circuit boards. Excessive heat may lift a conductor
or damage the board.
Model 415Е
с. Use a suction device (Table 5-3) or wooden tooth-
pick to remove solder from component mounting holes.
DO NOT USE A SHARP METAL OBJECT SUCH AS AN
AWL OR TWIST DRILL FOR THIS PURPOSE, SHARP
OBJECTS MAY DAMAGE THE PLATED-THROUGH
CONDUCTOR,
d. After soldering, remove excess flux from the
Soldered area and apply a protective coating to pre-
vent contamination and corrosion. See Table 5-3 for
recommendations.
5-22. COMPONENT REPLACEMENT,
a. Remove defective component from circuit board.
b. Remove solder from mounting holes usingasuc-
tion desoldering aid (Table 5-3) or wooden toothpick.
c. Shape leads of replacement component to match
mounting hole spacing.
d. Insert component leads into mounting holes and
position component as original was positioned. DO
NOT FORCE LEADS OF REPLACEMENT COMPO-
NENT INTO MOUNTING HOLES. Sharp lead ends
may damage plated-through conductor.
Note: Axial lead components, suchas resist-
ors and tubular capacitors, can be replaced
without unsoldering. Clip leads near body of
defective component, remove component and
Straighten leads left in board. Wrap leadsof
replacement component one turn around orig-
inal leads. Solder wrapped connection, and
clip off excess lead.
Table 5-3. Etched Circuit Soldering Equipment
Item Use Specification
Wattage rating: 37.5
Tip Temp: 750 - 800°F
Tip Size: 1/8" OD
Item Recommended
Ungar #776 Handle with
Ungar #1237 Heating Unit
Soldering Tool Soldering
Unsoldering
|== === ===
Soldering Tip, Soldering
general purpose | Unsoldering
Shape: chisel
Size: 1/8"
Ungar #PL113
Unsoldering multi-
connection components
De-soldering aid
Suction device to remove
molten solder from
Soldapullt by the Edsyn
Company, Arleta,
(e.g., tube sockets connection California
Resin (flux) Remove excess flux Must not dissolve etched Freon
Solvent from soldered area circuit base board ma- Acetone
before application of terial or conductor Lacquer Thinner
protective coating bonding agent Isopropyl Alcohol (100% dry)
Solder Component replacement Resin (flux) core, high
Circuit board repair tin content (60/40 tin/
Wiring lead), 18 gauge (SWG)
preferred
Protective Contamination, corrosion Good electrical insula- Krylon* 11302
Coating protection after soldering tion, corrosion-
prevention properties
Humiseal Protective Coating,
Type 1B12 by Columbia
Technical Corp. Woodside
77, New York
*Krylon Inc., Norristown, Pennsylvania
5-8
02152-3
алые

HP 415E Specifications

General

Brand	HP
Model	415E
Category	Measuring Instruments
Language	English